Research progress in interface modification and thermal conduction behavior of diamond/metal composites  

作　　者：Ping Zhu Pingping Wang Puzhen Shao Xiu Lin Ziyang Xiu Qiang Zhang Equo Kobayashi Gaohui Wu 

机构地区：[1]School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China [2]Key Laboratory of Advanced Structure-Function Integrated Materials and Green Manufacturing Technology,School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China [3]Industrial Technology Research Institute of Heilongjiang Province,Harbin 150001,China [4]Department of Materials Science and Engineering,Tokyo Institute of Technology,Tokyo 152-8550,Japan

出　　处：《International Journal of Minerals,Metallurgy and Materials》2022年第2期200-211,共12页矿物冶金与材料学报（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(Nos.52071117 and 51771063);the Heilongjiang Provincial Science Fund for Distinguished Young Scholars(No.JQ2021E002)。

摘　　要：Diamond/metal composites are widely used in aerospace and electronic packaging fields due to their outstanding high thermal conductivity and low expansion.However,the difference in chemical properties leads to interface incompatibility between diamond and metal,which has a considerable impact on the performance of the composites.To improve the interface compatibility between diamond and metal,it is necessary to modify the interface of composites.This paper reviews the experimental research on interface modification and the application of computational simulation in diamond/metal composites.Combining computational simulation with experimental methods is a promising way to promote diamond/metal composite interface modification research.

关 键 词：diamond/metal interface modification thermal conductivity computational simulation 

分 类 号：TB333[一般工业技术—材料科学与工程]