0.5GO/CeO_(2)-Cu30Cr10W复合材料的热变形行为  

Thermal deformation behavior of 0.5GO/CeO_(2)-Cu30Cr10W composites

作　　者：陈翱 侯瑾睿 周孟 田保红[1,2] 刘勇 CHEN Ao;HOU Jin-rui;ZHOU Meng;TIAN Bao-hong;LIU Yong(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471000,China;Provincial and Ministerial Co-construction of Collaborative Innovation Center for Non-ferrous Metal New Materials and Advanced Pressing Technology,Luoyang 471000,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471000 [2]有色金属新材料与先进加工技术省部共建协同创新中心,河南洛阳471000

出　　处：《材料热处理学报》2021年第12期19-26,共8页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(52071134);河南省优秀人才创新基金(ZYQR201912164);河南省高等学校重点科研项目(21A430013);河南省自然科学基金(202300410144)。

摘　　要：采用冷冻干燥和放电等离子烧结的方法制备了原位石墨烯掺杂氧化铈增强的0.5GO/CeO_(2)-Cu30Cr10W复合材料。在600~900℃的变形温度范围和0.001~1 s^(-1)应变速率条件下,利用Gleeble-1500D热模拟试验机对复合材料进行了等温压缩试验,利用光学显微镜和透射电镜分析了其微观组织,绘制了不同试验条件下的真应力-真应变曲线,基于双曲正弦模型构建了复合材料的本构方程。结果表明:复合材料的抗拉强度为386 MPa,导电率为63.8%IACS;在热变形过程中,复合材料的流变应力随着热变形温度的升高而减小,随着应变速率的增大而增加,呈现出热敏感性和正应变速率敏感性;铬颗粒被挤压成条状,大量的位错缠结成网状位错结构,复合材料的动态再结晶机制是不连续的动态再结晶。In situ graphene doped CeO_(2) reinforced 0.5GO/CeO_(2)-Cu30Cr10W composites were prepared by freeze-drying and spark plasma sintering.Under the deformation temperature range of 600-900℃and the strain rate of 0.001-1 s^(-1),the isothermal compression test of the composites was carried out by Gleeble-1500D thermal simulation test machine,microstructure was analyzed by optical microscope and transmission electron microscopy,the true stress-strain curves under different test conditions were drawn,and the constitutive equation of the composites was constructed based on the hyperbolic sinusoidal model.The results show that the tensile strength of the composites is 386 MPa and the conductivity is 63.8%IACS.In the process of thermal deformation,the flow stress of the composites decreases with the increase of thermal deformation temperature and increases with the increase of strain rate,showing thermal sensitivity and normal strain rate sensitivity.The Cr particles are extruded into strips,and a large number of dislocations are entangled into a network dislocation structure,and the dynamic recrystallization mechanism of the composites is discontinuous dynamic recrystallization.

关 键 词：GO/CeO_(2)-Cu30Cr10W复合材料 石墨烯 热变形 本构方程 

分 类 号：TB333[一般工业技术—材料科学与工程]