高多层超长高速背板工艺研究  

Research on the technology for high-speed backplane with high layer count and super long size

作　　者：唐成华 黄克强 黄建国 张长明 Tang Chenghua;Huang Keqiang;Huang Jianguo;Zhang Changming

机构地区：[1]深圳市博敏电子有限公司,广东深圳518103

出　　处：《印制电路信息》2022年第1期56-61,共6页Printed Circuit Information

摘　　要：相比常规高多层背板而言,超长背板的尺寸稳定性较难控制,孔到线距离越来越小,层间对准度要求越高。文章主要介绍一种34层超长板的关键制作工艺,包括涨缩的管控,层间对准度的控制,背钻堵孔的改善,阻抗的控制等,为重点关键流程提供制作方法及解决方案。Compared with the conventional high-multilayer backplane,the dimensional stability of super long backplane is more difficult to control.The distance from hole to line is smaller,and the inter-layer alignment is higher.This paper mainly introduces a key manufacturing process of a 34-layer super long size PCB and provides manufacturing methods and solution for it,which includes the control of expansion and contraction,the control of interlayer alignment,the improvement of blocking hole in backdrill process,and the control of impedance.

关 键 词：超长板 背板 阻抗 背钻 

分 类 号：TN41[电子电信—微电子学与固体电子学]