信号转接卡测试异常现象及其失效机理分析  

Test Abnormality Analysis and Failure Mechanism Research of Signal Adapter Card

作　　者：周舟 何日吉 肖慧 ZHOU Zhou;HE Riji;XIAO Hui(The 5th Research Institute of MIIT,Guangzhou 510610,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子工艺技术》2022年第1期22-25,共4页Electronics Process Technology

基　　金：国家重点研发计划项目(2020YFB1710300);广州市科技计划项目(202002030357);工业和信息化部电子第五研究所专项基金(20Z32)资助。

摘　　要：信号转接卡作为不同模块间信号传输的重要组成部分,其板上连接器发生失效将导致整个信号传输系统无法正常工作。通过分析信号转接卡上插板连接器测试异常,深入剖析产生该类失效的原因及具体的失效机理。将失效机理和转接卡的工艺过程结合起来,再对单板的工艺设计方案及装联工艺参数进行精准优化,进而达到降低信号转接卡的失效风险和提升良率的目的。The signal adapter card is an important part of signal transmission between different modules,and the failure of its on-board connector will cause the entire signal transmission system to work abnormally.By analyzing the test abnormalities of the plug-in connector on the signal adapter card,the reasons for this type of failure and the specific failure mechanism are deeply analyzed.Combining the failure mechanism with the manufacturing process of the adapter card,the process design plan and assembly process parameters of the board are accurately optimized,so as to reduce the failure risk of the adapter card and improve the yield rate.

关 键 词：印制电路板 连接器 电化学迁移 信号传输 波峰焊 

分 类 号：TN606[电子电信—电路与系统]