混合微电路用多芯组瓷介电容加固技术  

Reinforcement Technology of Multi-core Ceramic Capacitor for Hybrid Microcircuit

作　　者：史海林 席亚莉[1] 杜阳 房坤 韩可 杨柳 SHI Hailin;XI Yali;DU Yang;FANG Kun;HAN Ke;YANG Liu(The 771st Research Institute of CASA,Xi'an 710119,China)

机构地区：[1]中国航天科技集团公司第九研究院第七七一研究所,陕西西安710119

出　　处：《电子工艺技术》2022年第1期32-35,共4页Electronics Process Technology

摘　　要：多芯组瓷介电容具有单位安装面积容量大、抗机械应力强、等效串联电阻低等优点,在混合电路中具有很大的应用前景。简述了多芯组瓷介电容的工艺结构,通过仿真分析以及试验验证,确定了一种多芯组瓷介电容的加固方式,解决了多芯组瓷介电容在混合电路中安装可靠性低的问题。Multi-core ceramic capacitors have the advantages of large capacity per unit installation area,strong resistance to mechanical stress and low equivalent series resistance,and have great application prospects in hybrid microcircuit.The process structure of multi-core ceramic capacitor is briefly described.Through simulation analysis and experimental verification,a reinforcement method of multi-core ceramic capacitor is determined,which solves the problem of low installation reliability for multi-core ceramic capacitor in hybrid microcircuit.

关 键 词：多芯组瓷介电容 加固 仿真 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]