DirectFET封装器件组装工艺的可靠性分析  

Assembly Reliability for Devices of DirectFET Packaging

作　　者：黄国平[1] 支林 蒋攀峰 唐锴 HUANG Guoping;ZHI Lin;JIANG Panfeng;TANG Kai(The 43rd Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088

出　　处：《电子工艺技术》2022年第1期46-49,59,共5页Electronics Process Technology

摘　　要：DirectFET是功率MOSFET器件的一种系列封装形式。叙述了DirectFET封装器件在实际使用过程中出现的一些问题,阐述了解决这些问题的设计途径和工艺措施,对DirectFET封装器件焊接工艺的可靠性进行了评价试验,给出了相关试验结论。DIRECTFET is a series of packaging forms of power MOSFET devices.Some problems of practical application process for DirectFET packaging devices are described,the design method and process measures to solve these problems are expounded,then the evaluation experiments are proceed for the reliability of soldering process of DirectFET packaging devices,and the relevant experimental conclusions are found.

关 键 词：DirectFET封装器件 焊接 可靠性 

分 类 号：TN60[电子电信—电路与系统]