基板形貌对0.5 g/m^(2)镀层电镀锡板耐蚀性的影响  

Effect of Morphology of Substrate Plate on Corrosion Resistance of 0.5 g/m^(2) Coating Electroplated Tinplate

作　　者：周保欣 徐海卫 方圆 石云光 胡建军 ZHOU Bao-xin;XU Hai-wei;FANG Yuan;SHI Yun-guang;HU Jian-jun(TechCenter,Shougang Jingtang United Iron and Steel Co.,Ltd.,Tangshan 063200,China;Tinning Department,Shougang Jingtang United Iron and Steel Co.,Ltd.,Tangshan 063200,China)

机构地区：[1]首钢京唐钢铁联合有限责任公司技术中心,河北唐山063200 [2]首钢京唐钢铁联合有限责任公司镀锡板事业部,河北唐山063200

出　　处：《材料保护》2021年第12期137-140,144,共5页Materials Protection

摘　　要：为了开发具备一定耐蚀能力的低锡铁,通过实验室模拟电镀和生产线工业试验,研究了基板形貌对0.5 g/m^(2)镀层镀锡板耐蚀性的影响。结果表明:轧制纹路模糊、无较深凹坑、表面平缓的基板电镀后镀层分布更均匀,耐蚀性更好;对于低锡铁,三维轮廓参数峰度Sku、偏斜度Ssk相比R a更适用于评价基板的表面形貌。In order to develop low tin steel with certain corrosion resistance,the influence of morphology of substrate plate on corrosion resistance of 0.5 g/m^(2)coating tinplate was studied through electroplating in laboratory and industrial experiments of production line.The substrate with fuzzy rolling lines,no deep pits and smoother surface had more uniform coating distribution and better corrosion resistance after electroplating.For low tin steel,the three-dimensional profile parameters kurtosis Sku and skewness Ssk were more suitable for evaluating the surface morphology of substrates than R a.

关 键 词：电镀锡 基板表面形貌 SKU SSK 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]