计算机CPU散热器结构仿真分析  

Computer CPU Heat Dissipation Structure Simulation Analysis Based on ANASYS

作　　者：郭钦奎 袁磊[1] 王海琪 杨镇华 GUO Qinkui;YUAN Lei;WANG Haiqi;YANG Zhenhua(The Engineering&Technical College of Chengdu University of Technology,Leshan Sichuan 614000,China)

机构地区：[1]成都理工大学工程技术学院,四川乐山614000

出　　处：《信息与电脑》2021年第22期17-19,共3页Information & Computer

摘　　要：中央处理器(Central Processing Unit,CPU)是计算机的核心,在计算机的运行中发挥着至关重要的作用。计算机设备在运行中,因设备高速运转,中央处理器的温度将会升高。笔者使用仿真软件建立物理模型,并对CPU翅片厚度与翅片之间的间距的比值(即间距比)以及CPU材料进行分析。仿真结果表明,当材料为铝、风速为2m/s、间距比为1.86时,CPU的温度最低,为35.78℃;当CPU间距比为1.86、材料为铜时,CPU的温度最佳。CPU is the core of computer and plays a vital role in the operation of computer.When the computer equipment is running,the temperature of the central processing unit will rise due to the high-speed operation of the equipment.The author uses the simulation software to establish the physical model,and analyzes the ratio of CPU fin thickness to fin spacing and CPU material.The simulation results show that when the material is aluminum,the wind speed is 2 m/s and the spacing ratio is 1.86,the temperature of CPU is the lowest,which is 35.78℃;When the CPU spacing ratio is 1.86 and the material is copper,the CPU temperature is the best.

关 键 词：CPU散热器 间距比 材料 仿真 

分 类 号：TB657.5[一般工业技术—制冷工程]