半导体制冷元器件性能参数测试实验研究  

Experimental measurment of performance of semiconductor refrigeration components

作　　者：黄双福[1] 刘曦 袁俊威 HUANG Shuangfu;LIU Xi;YUAN Junwei(College of Zhicheng,Fuzhou University,Fuzhou 350002,China;School of Chemical Engineering,Fuzhou University,Fuzhou 350116,China)

机构地区：[1]福州大学至诚学院,福建福州350002 [2]福州大学石油化工学院,福建福州350116

出　　处：《热科学与技术》2021年第6期521-527,共7页Journal of Thermal Science and Technology

基　　金：国家基础科学人才培养基金资助项目(J1103303);福建省中青年教师教育科研资助项目(JAT191110)。

摘　　要：设计了一套半导体制冷元器件性能参数测试装置,利用该装置通过实验测得型号TEC1-12706半导体制冷元器件的制冷量和散热量,并结合实验数据与理论计算推导出半导体元器件冷热端温度及相关性能参数。实验结果表明,该装置可测试出半导体制冷元器件在不同温度下的电阻R、塞贝克系数α、导热系数κ和优质系数Z等性能参数;同时,对测试结果的准确性进行了分析,指出实验测试的不足,并对测试数据进行了修正,修正结果显示了半导体性能参数与平均温度之间的关系。该装置对半导体制冷元器件性能参数测试结果数量级与相关文献测试结果一致,具有一定的准确性,能够为半导体性能参数测试研究提供参考。A device for testing the performance parameters of semiconductor refrigeration components was designed,which could be used to measure the cooling capacity and heat dissipation of Model TEC1-12706 semiconductor refrigeration components.Combined with experimental data and theoretical calculation,the temperature of the hot and cold ends of semiconductor components and related performance parameters were derived.The experimental results show that the device can test the resistance R,Seebeck coefficientα,thermal conductivityκand high-quality coefficient Z of semiconductor refrigeration components at different temperatures.The accuracy of the test results was analyzed,the shortcomings of the experimental tests were pointed out,and the test data was corrected.The designed device could be applied to measure the performance parameters of semiconductor refrigeration components for the data are agree with the relative references,and can provide a reference for the research of the performance parameters of semiconductor.

关 键 词：半导体制冷元器件 实验研究 性能参数 

分 类 号：TH12[机械工程—机械设计及理论]