温度和电流密度对亚硫酸盐电镀金的影响  

Effects of temperature and current density on gold electroplating in a sulfite-based bath

作　　者：肖江[1] 张超[1] 张伟[1] 张云望[1] 卢春林[1] XIAO Jiang;ZHANG Chao;ZHANG Wei;ZHANG Yunwang;LU Chunlin(Laser Fusion Research Center,China Academy of Engineering Physics,Mianyang 621900,China)

机构地区：[1]中国工程物理研究院激光聚变研究中心,四川绵阳621900

出　　处：《电镀与涂饰》2022年第1期1-5,共5页Electroplating & Finishing

摘　　要：采用亚硫酸盐体系镀液在紫铜表面电镀金。研究了镀液温度和电流密度对电镀金层晶相结构和纳米硬度的影响。结果表明,随着镀液温度升高,金层由(220)面择优生长转变为(111)面择优生长,纳米硬度变化不大。随着电流密度增大,金层由(111)面择优生长转变为(220)面择优生长,纳米硬度减小。电镀金层的晶粒尺寸受镀液温度和电流密度的影响不大,维持在30 nm左右。较佳的镀液温度和电流密度分别为55℃和3 mA/cm^(2),该条件下所得金层呈镜面光亮,结晶细致,纳米硬度约2.6 GPa,远高于冶炼纯金。Gold electroplating was conducted on red copper substrate in a sulfite-based bath.The effects of bath temperature and current density on the crystal phase structure and nanohardness of gold coating were studied.The results showed that the preferential orientation of gold coating transferred from(220)plane to(111)plane with the increasing of bath temperature,while the nanohardness varied little.The preferential orientation of gold coating transferred from(111)plane to(220)plane with the increasing of current density,and the nanohardness decreased.The grain size of gold coating was unsensitive to the variation of bath temperature and current density,and kept at 30 nm around.The optimal bath temperature and current density are 55℃ and 3 mA/cm^(2) respectively.The gold coating electroplated thereunder is mirror-bright with fine and compact crystal structure,as well as a nanohardness of ca.2.6 GPa,which is much higher than that of smelt pure gold.

关 键 词：电镀金 亚硫酸盐体系 晶相结构 纳米硬度 温度 电流密度 

分 类 号：TQ153.18[化学工程—电化学工业]