中温固化的单组分环氧胶粘剂的制备与性能研究  

The Preparation of Medium Temperature Curing One Component Epoxy Adhesive and Study on Its Performances

作　　者：胡生祥 曹兴园 吴欢 屈雪艳 杨忠奎 秦瑞瑞 张燕红 HU Sheng-xiang;CAO Xing-yuan;WU Huan;QU Xue-yan;YANG Zhong-kui;QIN Rui-rui;ZHANG Yan-hong(Zhengzhou Zhongyuan Silande High Technology Co.,Ltd.,Zhengzhou 450000,China)

机构地区：[1]郑州中原思蓝德高科股份有限公司,河南郑州450007

出　　处：《化学与粘合》2022年第1期51-53,75,共4页Chemistry and Adhesion

摘　　要：采用改性胺类潜伏性固化剂制备单组分环氧胶粘剂,并研究固化剂含量、增韧剂含量、填料种类、偶联剂种类对终产物的性能影响。结果表明,当固化剂含量为15%,增韧剂含量为15%,粉料选择硅微粉,偶联剂选择M110时,所得单组分环氧胶粘剂可在80℃×30min条件下固化,并且固化后产品性能最优。The one component epoxy adhesive is prepared with a modified amine latent curing agent,and the influences of some factors on the properties of the adhesive are studied,including the content of the curing agent and the toughing agent,the category of the fillers and the coupling a-gents.The results show that the epoxy adhesive can be cured at 80℃ in 30 min and it exhibits excellent properties when the content of the curing agent and the toughing agent are both 15%,and the silica powder and the M110 is selected as fillers and as coupling agent respectively.

关 键 词：单组分环氧 改性胺固化剂 中温固化 增韧剂 

分 类 号：TQ433.437[化学工程]