填料填充型聚合物基导热材料的研究进展  

Research Progress of Filler-filled Polymer-based Thermal Conductive Materials

作　　者：汪朝宇 郝智[1,2] 申腙 周琴 WANG Chao-yu;HAO Zhi;SHEN Zong;ZHOU Qin(College of Materials and Metallurgy.Guizhou University,Guiyang 550025,China;Guizhou Province Engineering Laboratory for Rubber Composites,Guiyang 550025,China)

机构地区：[1]贵州大学材料与冶金学院,贵阳550025 [2]贵州省橡胶复合材料工程实验室,贵阳550025

出　　处：《高分子通报》2022年第1期18-23,共6页Polymer Bulletin

基　　金：黔科合支撑[2019]2030号。

摘　　要：大多数聚合物由于导热性差等缺点,限制了其在许多领域的应用,因此需要添加导热填料增强聚合物的导热性能,提高材料的使用价值。但是导热填料难以均匀分散到聚合物中,极大地制约了其在高性能热界面材料中的应用,所以需要对填料进行表面功能化,提高其分散性和降低填料与基体之间的界面热阻。无论表面功能化的类型如何,不可避免地都会减弱填料间的声子传递,通过化学气相沉积法、溶胶-凝胶法等方法设计结构可以显著降低填料颗粒间的界面接触热阻。构建三维导热连接网络是降低填料颗粒间界面热阻的一种有效可行的策略。Most polymers have poor thermal conductivity and other shortcomings,which limit their applications in many fields.Therefore,it is necessary to add thermal conductive fillers to enhance the thermal conductivity of polymers and improve the use value of materials.However,it is difficult to uniformly disperse the thermally conductive filler into the polymer,which greatly restricts its application in high-performance thermal interface materials.Therefore,it is necessary to functionalize the filler to improve its dispersibility and reduce the interfacial thermal resistance between the filler and the matrix.Regardless of the type of surface functionalization,phonon transmission between fillers will inevitably be weakened.Designing structures by chemical vapor deposition,sol-gel method and other methods can significantly reduce the interface contact thermal resistance between filler particles.Constructing a three-dimensional thermally conductive connection network is an effective and feasible strategy to reduce the interface thermal resistance between filler particles.

关 键 词：导热 分散性 填料表面功能化 三维导热网络 界面热阻 

分 类 号：TB33[一般工业技术—材料科学与工程] TQ317[化学工程—高聚物工业]