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作 者:韩耀 谢志鹏[2] 李海燕 董衡 张冰清 HAN Yao;XIE Zhipeng;LI Haiyan;DONG Heng;ZHANG Bingqing(Aerospace Institute of Advanced Materials&Processing Technology,Beijing 100074,China;State Key Laboratory of New Ceramics and Fine Processing,Tsinghua University,Beijing 100084,China;China Building Material Test&Certification Group Co.,Ltd,Beijing 100024,China)
机构地区:[1]航天特种材料及工艺技术研究所,北京100074 [2]清华大学,新型陶瓷与精细工艺国家重点实验室,北京100084 [3]中国建材检验认证集团股份有限公司,北京100024
出 处:《硅酸盐学报》2021年第12期2549-2555,共7页Journal of The Chinese Ceramic Society
基 金:国家自然科学基金(52002364、5167020125)资助。
摘 要:采用新型振荡压力烧结工艺(OPS)制备了h-BN陶瓷,研究了振荡压力对h-BN陶瓷烧结致密化以及晶粒生长的影响,并结合致密度、微观结构及断裂可靠性等因素,对不同烧结工艺下的氮化硼陶瓷的晶粒定向程度以及力学和热学性能进行了探究。研究表明:与采用热压烧结工艺(HP)制备的氮化硼陶瓷相比,采用OPS工艺制备的陶瓷表面更为致密,断面的晶粒定向排列逐渐清晰,高比例平行排列的片状BN晶粒能有效提高BN陶瓷的致密化程度。OPS试样的硬度、断裂韧性以及抗弯强度最高分别达到了0.31 GPa、1.09 MPa·m^(1/2)和74.4 MPa,较相同烧结参数下的HP试样有了大幅提升。结合XRD谱计算出的晶粒定向排列数据可知,振荡压力的引入明显促进了氮化硼陶瓷的致密化烧结,断裂可靠性和热导率均获得了提高。High h-BN ceramics were prepared by an oscillatory pressure sintering technique(OPS),and the effect of oscillatory pressure on the sintering densification and grain growth of h-BN ceramics was investigated.Boron nitride ceramics were also prepared by a hot pressing sintering process(HP).The density,microstructure,fracture reliability,degree of grain orientation,mechanical and thermal properties of boron nitride ceramics at different sintering processes were analyzed.The results show that the fracture surface of OPS specimens is denser,and the grain orientation becomes clear,compared with those of HP specimens.A high proportion of parallel-arranged BN grains can effectively improve the densification of BN ceramics.The maximum hardness,fracture toughness and flexural strength of OPS specimens are 0.31 GPa,1.09 MPa·m^(1/2) and 74.4 MPa,respectively,which are greatly improved,compared with HP specimens at the same sintering parameters.According to the data of grain orientation determined by X-ray diffraction patterns,the application of oscillatory pressure obviously promotes the densification and sintering of boron nitride ceramics,thus improving the fracture reliability and thermal conductivity.
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