机载综合模块化处理平台光互联方法研究  

Optical Interconnection for Airborne Integrated Modular Processor Platform

作　　者：湛文韬 杨柳 王小波 ZHAN Wentao;YANG Liu;WANG Xiaobo(Aeronautical Computing Technique Research Institute,AVIC,Xi'an 710000,China)

机构地区：[1]中国航空工业集团公司西安航空计算技术研究所,西安710000

出　　处：《电光与控制》2022年第2期82-86,共5页Electronics Optics & Control

基　　金：航空科学基金(2017ZC31008)。

摘　　要：目前航电系统中应用的机载综合模块化处理平台存在两种构型,分别是集中式机箱配置LRM模块和托架安装的ARINC600标准LRU单元。针对这两种构型及机载光互联技术现状,分别描述了各自的特点及光互联方法采用的光电转换、高密度接口传输等工程化实现方式。最后对当前光互联方法的验证结果进行了描述,对未来改进方向进行了探讨。In avionics systems,there are two configurations of airborne integrated modular processor platform: one is LRM configured in a centralized cabin and the other is ARINC600 LRU installed on a bracket.As for the two configurations,their characteristics are described respectively.Based on the status quo of airborne optical interconnection technology,its engineering realization modes of optical-electric transformation and high-density interface transmission are introduced.The verification results of current optical interconnection methods are described,and then the direction of future improvement is discussed.

关 键 词：航电系统 光互联 集中式 光背板 高密度接口 全光网络 

分 类 号：TP336[自动化与计算机技术—计算机系统结构]