一种制造半导体瀑布式蚀刻机设计及其应用研究  

Scheme Design and Application of a Semiconductor Waterfall Etcher

作　　者：沈天成 陈叶娣[1] 姚佳 刘星宇 卢炎 SHEN Tiancheng;CHEN Yedi;YAO Jia;LIU Xingyu;LU Yan(Changzhou Vocational Institute of Mechatronic Technology,Changzhou,Jiangsu Province,213164 China)

机构地区：[1]常州机电职业技术学院,江苏常州213164

出　　处：《科技资讯》2021年第36期13-15,共3页Science & Technology Information

摘　　要：该文首先提出了常见的玻璃表面蚀刻装置在蚀刻处理玻璃表面过程中的问题及事后蚀刻装置对玻璃不易清洗的问题,通过对蚀刻机重新设计,提出了制造半导体瀑布式蚀刻机的设计方案和运行过程,经验证明其满足玻璃蚀刻装置的要求,叙述了新型玻璃蚀刻装置结构设计所带来的有益效果,然后阐述了玻璃蚀刻机在工业方面和工艺方面的应用,最后提出了蚀刻机未来发展在蚀刻准确度、安全与环保方面仍然需要注意的问题。The article first puts forward the problem of common glass surface etching device in the process of etching the glass surface and the problem that the etching device is not easy to clean the glass afterwards.Through the redesign of the etching machine,the design scheme and operation of manufacturing the semiconductor waterfall etching machine are proposed.The process is verified to meet the requirements of the glass etching device,and the beneficial effects brought by the structural design of the new glass etching device are described.Then,the industrial and technological application of the glass etching machine is explained.Finally,the future development of the etching machine is proposed in the etching accuracy,issues that still need attention in safety and environmental protection.

关 键 词：蚀刻机 玻璃蚀刻 工艺创新 工业生产 

分 类 号：TN30[电子电信—物理电子学]