耐高温聚酰亚胺树脂复合材料固化封装技术研究  

Research on the curing packaging technology of high temperature polyimide composites

作　　者：梁恒亮 周洪飞 陈静 LIANG Heng-liang;ZHOU Hong-fei;CHEN Jing(AVIC Manufacturing Technology Institute,Beijing 101300,China;AVIC Composite Co.,Ltd.,Beijing 101300,China)

机构地区：[1]航空工业制造院复材中心,北京101300 [2]中航复合材料有限责任公司,北京101300

出　　处：《复合材料科学与工程》2022年第1期112-116,共5页Composites Science and Engineering

摘　　要：针对热压罐-真空袋成型、固化温度为375℃的聚酰亚胺树脂,其固化温度已接近高温真空袋和高温密封材料等耐温上限,单层真空袋封装体系经常在固化过程中发生破损;本文采用新的封装工艺即双真空和机械密封等封装工艺来保障BMP370复合材料固化所需的真空度,从而完成BMP370制件的固化,双真空封装固化后制件经无损检测、玻璃化转变温度及随炉件力学性能测试,符合标准要求,表明双真空封装合理可行。For polyimide resins with a temperature of 375 ℃ for the thermos-pressor tank-vacuum bag molding curing temperature, the single-layer vacuum bag package system is often broken in the curing process because the curing temperature is close to the temperature limit of high temperature vacuum bag and high temperature sealing material. Dual vacuum package cured parts by non-destructive testing, glass transition temperature and with the furnace part bending and layer shear performance test, in line with the standard requirements, indicating that the dual vacuum package is reasonable and feasible.

关 键 词：热压罐工艺 聚酰亚胺 密封 复合材料 

分 类 号：TB332[一般工业技术—材料科学与工程]