硅酸钠对碱性低氢焊条性能的影响  

Effect of Sodium Silicate on Performance of Alkaline Low Hydrogen Electrode

作　　者：王效莲[1] 亢天佑 王囤 WANG Xiaolian;KANG Tianyou;WANG Dun(Luoyang Ship Material Research Institute,Luoyang 471023,China)

机构地区：[1]中国船舶重工集团公司第七二五研究所,河南洛阳471023

出　　处：《材料开发与应用》2021年第6期67-70,共4页Development and Application of Materials

摘　　要：研究了硅酸钠对碱性低氢焊条性能的影响.试验结果表明,适当增加药皮中的硅酸钠含量,可使焊条套筒长度减小,熔渣黏度减小,立焊笔尖倾向减小,飞溅稍微增大,而焊条熔敷金属的化学成分、力学性能和扩散氢含量的变化则不明显.故可以通过调整碱性低氢焊条药皮中硅酸钠的含量来优化焊接工艺性.Effect of sodium silicate on performances of alkaline low hydrogen electrode is studied.Test results show that increasing the content of sodium silicate in coating of electrode could reduce electrode sleeve length,slag viscosity and tendency of vertical welding nibs,and increase splash slightly,and that the chemical composition and mechanical properties of deposited metal of welding electrodes and content of diffusion hydrogen have no obvious change.Therefore,the welding technicality could be optimized by adjusting content of sodium silicate in the coating of alkaline low hydrogen electrode.

关 键 词：硅酸钠 碱性低氢焊条 焊接工艺性 

分 类 号：TG44[金属学及工艺—焊接]