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作 者:吴济华 吴荣萱 Wu Jihua;Wu Rongxuan
机构地区:[1]珠海市一心材料科技有限公司,广东珠海519170
出 处:《印制电路信息》2022年第2期56-60,共5页Printed Circuit Information
摘 要:挠性印制电路板(FPCB)制造使用的挠性覆铜箔基板(FCCL),其厚度相对比较薄,在制造过程受力作用或操作不当容易造成损伤和折皱。为解决上述技术难题,行业上多使用单面承载膜进行支撑和保护FCCL基材。经过承载膜支撑和保护,FCCL基材在压合,固化,化金等制程中能始终保持平整,免受弯折,拿取方便,制造品质均匀。作为单面承载膜的应用延伸,本文特别论述一种双面承载膜上下固定两块FCCL基材同时进行单面FPCB生产的方式,可以避免薄板加工中不良影响,并能提高生产效率。The basic material used in the manufacture of FPCB is usually FCCL substrate,which is relatively thin,and it is easy to cause damage and wrinkle due to stress or improper operation in the manufacturing process.In order to solve the above technical problems,single-sided carrier film is often used in the industry to support and protect FCCL substrate.Through the support and protection of the carrier film,the FCCL substrate can always remain flat,free from bending,easy to take and uniform manufacturing quality in the processes of pressing,curing and metallization.As an extension of the application of single-sided carrier film,this paper especially discusses a method of double-sided carrier film fixing two FCCL substrates up and down for single-sided FPCB production at the same time,which can avoid the adverse effects in sheet processing and improve the production efficiency.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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