基于高精度光电编码器组装精度超差工艺研究  

Research on Assembly Accuracy out of Tolerance Process Based on High Precision Photoelectric Encoder

作　　者：高虎 Gao Hu(Lianyungang Jari Electronics Co.,Ltd.,Jiangsu Lianyungang 222006)

机构地区：[1]连云港杰瑞电子有限公司,江苏连云港222006

出　　处：《电子质量》2022年第1期13-16,共4页Electronics Quality

摘　　要：基于高精度光电编码器精度超差为产品不合格的主要原因,为了提高产品的合格率,通过理论分析,结合光电编码器组装流程定位精度超差问题,经过结构和印制板设计改进、工艺参数优化等方法进行验证,可有效提高产品的精度。The out of tolerance of photoelectric encoder based on high precision photoelectric encoder is the main reason for the disqualification of products. In order to improve the qualification rate of products, through theoretical analysis, combined with the out of tolerance of positioning accuracy of photoelectric encoder assembly process, the accuracy of products can be effectively improved through the improvement of structure and printed board design and the optimization of process parameters.

关 键 词：精度超差 误差 码盘 转轴 改进 

分 类 号：TN762[电子电信—电路与系统]