基于激光位移传感器的PCB板翘曲度测量系统设计  

Design of PCB Board Warpage Measurement System Based on Laser Displacement Sensor

作　　者：许佳豪 刘润利 尚晓峰 吴志鹏 张哲 XU Jiahao;LIU Runli;SHANG Xiaofeng;WU Zhipeng;ZHANG Zhe(School of Electronics and Information,Xi'an Polytechnic University,Xi'an Shaanxi 710048,China)

机构地区：[1]西安工程大学电子信息学院,陕西西安710048

出　　处：《信息与电脑》2021年第24期33-35,共3页Information & Computer

摘　　要：为了实现印制电路板(Printed Circuit Board,PCB)板翘曲度的非接触式精确测量,本文采用高精度激光位移传感器结合STM32处理器以及传动机构,设计了PCB板翘曲度测量系统。该系统控制步进电机使PCB板在丝杠滑台上进行横移,进而激光位移传感器在PCB板移动的过程中对PCB板表面的相对位移进行测量,并将测量到的数据上传至计算机进行分析、处理,最终得到翘曲度参数,实现PCB板翘曲度的非接触式测量。In order to realize the non-contact accurate measurement of PCB board warpage,a PCB board warpage measurement system is designed by using high-precision laser displacement sensor,STM32 processor and transmission mechanism.The system controls the stepping motor to make the PCB board traverse on the lead screw slide,and then the laser displacement sensor measures the relative displacement of the PCB board surface during the movement of the PCB board,and uploads the measured data to the computer for analysis and processing.Finally,the warpage parameters are obtained to realize the non-contact measurement of the warpage of the PCB board.

关 键 词：PCB板 激光位移传感器 翘曲度 非接触测量 

分 类 号：TN41[电子电信—微电子学与固体电子学]