Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application  

作　　者：Wei-Jie Hong Li-Li Yuan Hao-Yang Zhang Chao Cui Wei Chen Shi-Yong Yang 

机构地区：[1]Key Laboratory of Science and Technology on High-tech Polymer Materials,Chinese Academy of Sciences,Beijing 100190,China [2]School of Chemical Engineering,University of Chinese Academy of Sciences,Beijing 100049,China [3]Astronautical Systems Engineering Technology,Beijing 100076,China [4]Aerospace Research Institute of Materials&Processing Technology,Beijing 100076,China

出　　处：《Chinese Journal of Polymer Science》2022年第1期107-120,共14页高分子科学（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(No.51803222);Science and Technology Service Network Initiative,Chinese Academy of Sciences。

摘　　要：To meet the processing requirements of resin transfer moulding(RTM)technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4’-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA),3,4’-oxydianiline(3,4’-ODA)and m-phenylenediamine(m-PDA).This blend shows low minimum melting viscosity(<1 Pa·s)and enlarged processing temperature window(260–361℃).FPI-R-1 stays below 1 Pa·s for2 h at 270℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380℃for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance(T_(g)=420-426℃).

关 键 词：Oligoimide Resin transfer molding Reactive diluent Melting stability 

分 类 号：TQ317[化学工程—高聚物工业]