Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and enhancement of bonding strength by successive pressureless annealing  

用200 nm铜颗粒在空气中快速压力辅助烧结及连续无压退火提高结合强度

作　　者：Myeong In KIM Jong-Hyun LEE Myeong In KIM;Jong-Hyun LEE(Department of Materials Science and Engineering,Seoul National University of Science and Technology,232 Gongneung-ro,Nowon-gu,Seoul 139-743,Korea)

机构地区：[1]Department of Materials Science and Engineering,Seoul National University of Science and Technology,232 Gongneung-ro,Nowon-gu,Seoul 139-743,Korea

出　　处：《Transactions of Nonferrous Metals Society of China》2022年第2期629-638,共10页中国有色金属学报（英文版）

基　　金：the Materials&Components Technology Development Program(10080187);the Ministry of Trade,Industry&Energy(MI,Korea).

摘　　要：To design an effective and realistically applicable sinter bonding process for power devices,we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainability and superior thermal conductance.This process involved rapid pressure-assisted sinter bonding in air followed by pressureless annealing in a nitrogen atmosphere.In the case of a paste prepared with a mixture of 20 wt.%malic acid and 80 wt.%ethylene glycol,sinter bonding at 300℃and 5 MPa for only 30 s resulted in a sufficient shear strength of 23.1 MPa.The shear strength was significantly enhanced to 69.6 MPa by the additional pressureless aging for 30 min.Therefore,the two-step sinter bonding process is expected to provide an outstanding production rate as a next-generation sinter bonding process.为了设计一种有效且适用于功率器件的烧结结合工艺,提出一种两步工艺,使用约200 nm的铜颗粒基浆料形成具有高温可持续性和优越导热性的粘结层。该工艺涉及在空气中快速压力辅助烧结和在氮气气氛中连续无压退火。当使用20%(质量分数)的羟基丁二酸和80%(质量分数)的乙二醇混合物浆料时,在300°C、5 MPa烧结30 s后的剪切强度为23.1 MPa。辅助无压烧结30 min后,剪切强度显著提高至69.6 MPa。因此,两步烧结结合工艺有望作为下一代烧结结合工艺具有极高的生产效率。

关 键 词：submicron Cu particles Cu paste malic acid sinter bonding successive annealing shear strength 

分 类 号：TG156.2[金属学及工艺—热处理]