三维集成技术在红外探测器中的应用  

Application of 3D integration technology in infrared detector

作　　者：谭振[1] 聂媛 于艳[1] 田震[1] 喻松林[1] TAN Zhen;NIE Yuan;YU Yan;TIAN Zhen;YU Song-lin(Norch China Research Institue of Ecectro-Optics,Beijing 100015,Chian)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《激光与红外》2022年第2期163-169,共7页Laser & Infrared

摘　　要：红外探测器被广泛应用于红外侦查、预警、制导、遥感等领域。近些年来,随着应用需求的不断牵引,红外探测器在保持高空间分辨率、高温度灵敏度的同时,还需兼顾向小型化、集成化的发展。传统的单片式信号处理电路在极限性能、功能集成度方面已难以满足未来红外系统的发展需求,基于三维集成技术的红外探测器逐步成为解决方案之一,本文对微电子器件三维集成技术进行了简要介绍,列举了国外相关研究机构利用三维集成技术研制红外探测器的进展,探讨了三维集成技术在红外探测器研制中面临的挑战。Infrared detectors are widely used in infrared reconnaissance,warning,guidance and remote sensing areas.In the recent years,with the continuous traction of application demand,infrared detectors should not only maintain high resolution and high sensitivity,but also take into account the development of miniaturization and integration.The ultimate performance and functionality of traditional monolithic signal processing circuit has been difficult to meet the needs of infrared systems in the future,infrared detectors based on 3D integration gradually come to be a solution.This paper briefly introduced the three-dimensional integration technology of microelectronics,summarized the progress of relevant foreign research institutions in the development of infrared detectors using three-dimensional vertical technology,and discussed the challenge of three-dimensional integration technology in the development of infrared detectors.

关 键 词：三维集成 红外探测器 应用 挑战及发展趋势 

分 类 号：TN215[电子电信—物理电子学]