基于VOF法毫秒激光制孔过程数值研究及工艺优化  

Numerical research and process optimization of laser hole-making process based on VOF method

作　　者：崔静[1] 刘玲 夏海洋 杨广峰 CUI Jing;LIU Ling;XIA Hai-yang;YANG Guang-feng(Civil Aviation University of China,Tianjin 300300)

机构地区：[1]中国民航大学,天津300300

出　　处：《激光与红外》2022年第2期210-216,共7页Laser & Infrared

基　　金：国家自然科学基金项目-中国民航局民航联合研究基金(No.U1933107);天津市交通运输委员会面上项目;中央高校基本科研业务费项目(No.ZXH2012D011);中国民航大学蓝天青年学者培养经费项目资助。

摘　　要：针对毫秒激光制孔过程的热流耦合及孔的形成规律,基于VOF法构建了三维激光打孔数值模型。模型中考虑了材料去除过程中涉及到的重力、反冲击力以及固-液-气三相的相变过程,得到了不同脉冲个数下的温度场、相场以及孔形轮廓的变化。孔深与孔径的模拟结果与实验吻合较好。结果表明:相场中的气-固-液界面随着脉冲个数的增加逐渐下移;反冲压力的存在增加了上孔径和孔深;飞溅物随着脉冲个数的增加而增加;孔口往下约0.5 mm处呈碗型。Using the VOF method,a numerical model of three-dimensional laser punching is constructed based on the thermal flow coupling of the millisecond laser hole-making process and the formation law of the hole.In the model,the phase change process of gravity,anti-impact force and solid-liquid-gas involved in the material removal process is considered,and the temperature field,phase field and hole profile change are obtained under different pulse numbers.The simulation results of aperture and aperture are in good agreement with the experiment.The results show that the gas-solid-liquid interface in the phase field gradually moves down with the increase of pulse number.The presence of backstroke pressure increases the upper aperture and aperture;splashes increase with the number of pulses;the hole is bowl-shaped about 0.5 mm down.

关 键 词：毫秒激光 VOF法 相场 激光打孔 飞溅物 

分 类 号：V261.8[航空宇航科学与技术—航空宇航制造工程] TN249[电子电信—物理电子学]