2048×2048 HgCdTe红外焦平面杜瓦冷头热应力有限元分析  

Finite Element Analysis of Thermal Stress of 2048×2048 HgCdTe Infrared Focal Plane Dewar Cold Head

作　　者：熊雄 胡明灯 吴建乐 段煜 周勇强 杜宇 毛剑宏 XIONG Xiong;HU Ming-deng;WU Jian-le;DUAN yu;ZHOU Yong-qiang;DU Yu;MAO Jian-hong(Zhejiang Juexin Microelectronics Co. , Ltd. , Lishui 323000, China)

机构地区：[1]浙江珏芯微电子有限公司,浙江丽水323000

出　　处：《红外》2022年第2期22-27,39,共7页Infrared

摘　　要：利用有限元方法对2048×2048(15 m)红外焦平面杜瓦冷头的原始结构以及加入的平衡层结构进行了分析。在陶瓷基板下方增加膨胀系数较小的平衡层,对探测器芯片变形及热应力有一定的缓解作用。通过增大AlN平衡层上表面的直径,减小了芯片中心以外的翘曲范围,缓解了应力过于集中的问题。当直径超过芯片对角长度时,最大热应力骤减,最终趋于稳定;芯片变形量随之迅速减小。在直径为36 mm时,达到最小值(6.86 m);随后缓慢增加并趋于稳定。当AlN平衡层的直径超过芯片对角长度后,AlN平衡层的厚度对芯片变形的影响开始减小。通过加入AlN平衡层能够有效改善大面阵焦平面探测器芯片的变形及热应力,同时通过调节AlN平衡层的结构,可进一步优化探测器杜瓦组件的可靠性。The original structure and the added balance layer structure of the 2048×2048(15 m)infrared focal plane dewar cold head are analyzed by finite element method.Adding a balance layer with a lower expansion coefficient under the ceramic substrate can relieve the deformation and thermal stress of the detector chip to a certain extent.By increasing the diameter of the upper surface of the AlN balance layer,the warpage range beyond the center of the chip is reduced,and the problem of excessive stress concentration is alleviated.When the diameter exceeds the diagonal length of the chip,the maximum thermal stress decreases sharply,and finally tends to be stable;the deformation of the chip decreases rapidly.When the diameter is 36 mm,it reaches a minimum of 6.86 m;then it increases slowly and tends to be stable.When the diameter of the AlN balance layer exceeds the diagonal length of the chip,the influence of the thickness of the AlN balance layer on the chip deformation begins to decrease.The deformation and thermal stress of the large area array focal plane detector chip can be effectively improved by adding an AlN balance layer.The reliability of the detector Dewar component can be further optimized by adjusting the structure of the AlN balance layer.

关 键 词：红外探测器 杜瓦封装 有限元分析 热应力 

分 类 号：TN215[电子电信—物理电子学]