A facile and non-destructive quartz fiber shadow mask process for the sub-micrometer device fabrication on two-dimensional semiconductors  

作　　者：Li-An Li Fang-Yuan Zhao Shen-Qiang Zhai Feng-Qi Liu Zhong-Ming Wei 

机构地区：[1]Key Laboratory of Semiconductor Materials Science,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China [2]Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China [3]State Key Laboratory of Superlattices and Microstructures,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China

出　　处：《Rare Metals》2022年第1期319-324,共6页稀有金属（英文版）

基　　金：This work was financially supported by the National Natural Science Foundation of China(Nos.61734006,61835011 and 61991430);the National Basic Research Program of China(Nos.2018YFA0209100 and 2020YFB0408400).The authors would like to thank Ping Liang and Ying Hu from the Institute of Semiconductors Chinese Academy of Sciences for their help in device processing.

摘　　要：The normal fabrication process for electronic and optoelectronic devices can bring in significant modifications on two-dimensional(2D)semiconductors’intrinsic properties.To address this issue,some dry methods have been developed,such as“transfer contact”method and“shadow mask technology”.However,the method that can combine the advantages of low cost,non-destruction,and high reliability at sub-micrometer scale is rarely reported.Here,we demonstrate a fabrication technique using ultrafine quartz fibers as shadow masks.In this technique,sub-micrometer scale devices can be“all dry”fabricated facilely,and the intrinsic properties of 2D semiconductors are preserved.Meanwhile,the masking effect can be evaluated in situ based on the light interference between the quartz fiber and the substrate to increase the fabrication reliability.

关 键 词：QUARTZ fiber PROCESS 

分 类 号：TN305[电子电信—物理电子学]