5G用低介电材料的改性进展  

Progress of Low Dielectric Property Modified in 5G

作　　者：王淼 李继涛 邵宝刚 相鹏伟 WANG Miao;LI Jitao;SHAO Baogang;XIANG Pengwei(Sinoma Science&Technology(Suzhou)Co.,Ltd.,Suzhou,Jiangsu 215021,China)

机构地区：[1]中材科技(苏州)有限公司,江苏苏州215021

出　　处：《塑料》2022年第1期117-120,共4页Plastics

摘　　要：随着电子领域高频化、小型化的发展,对材料介电性能提出了更高的要求。聚苯硫醚(PPS)、液晶聚合物(LCP)等工程塑料介电性能稳定,在电子领域中具有一定的发展潜力。简要介绍了聚苯硫醚(PPS)、液晶聚合物(LCP)等工程塑料的特点,重点介绍了PPS和LCP材料在降低介电常数方面的研究进展。目前,改善方案主要包括物理方法、化学方法及工艺改善,如聚合物共混改性、低介电填料填充改性及通过微发泡工艺降低介电常数的方法。随着相关低介电填料的低成本化及微发泡工艺的普及,低介电改性材料性能将得到提升,并且更加稳定且性价比更高的低介电材料在新兴电子领域中将得到更广泛的应用。With the development of high frequency and miniaturization in electronic field,the dielectric properties of materials are also required.The dielectric property of engineering plastics,such as poluphenylene sulfide(PPS)and liquid crystal polymer(LCP)are stable and they have certain potential of development in the electronic field.Characteristics of polyphenylene sulfide(PPS)and liquid crystal polymer(LCP)engineering plastics are briefly introduced.The special molecular structure makes it outstanding electrical properties and stable dielectric properties in a higher frequency range.The research progress in reducing dielectric permittivity of PPS and LCP materials is introduced.The existing improvement schemes mainly include physical methods,chemical methods and Process improvement,such as polymer blending modification and low dielectric filler filling modification.In addition,the method of reducing dielectric constant by micro foaming process has also been studied.With the low cost of related low dielectric fillers and the popularization of micro foaming process,the performance of low dielectric modified materials will be improved and more stable,and the more cost-effective low dielectric materials will be more widely used in the emerging electronic field.

关 键 词：聚苯硫醚 液晶聚合物 介电性能 电子 物理改性 微发泡工艺 

分 类 号：TQ324.8[化学工程—合成树脂塑料工业] TQ326.5