填充型高导热环氧树脂复合材料的研究进展  

Research Progress of Filled Epoxy Resin Composites with High Thermal Conductivity

作　　者：张天栋 石壮壮 吴加雪 张昌海 冯宇 迟庆国[1] 李忠华[1] 陈庆国[1] ZHANG Tiandong;SHI Zhuangzhuang;WU Jiaxue;ZHANG Changhai;FENG Yu;CHI Qingguo;LI Zhonghua;CHEN Qingguo(School of Electrical and Electronic Engineering,Harbin University of Science and Technology,Harbin 150080,China)

机构地区：[1]哈尔滨理工大学电气与电子工程学院,黑龙江哈尔滨150080

出　　处：《绝缘材料》2022年第3期10-22,共13页Insulating Materials

基　　金：国家自然科学基金资助项目(U20A20308);黑龙江省自然科学基金团队项目(TD2019E002)。

摘　　要：本文从填充型环氧树脂的导热机理出发,主要综述了不同维度无机导热填料掺杂改性环氧树脂的研究现状。基于构筑导热通路的设计思想,重点阐述了不同维度的填料尺寸、分布取向、复合填充、表面功能化等因素对环氧树脂复合材料导热性能的改善效果,并进行了对比分析。最后对填充型环氧树脂研究领域未来的发展做了简要展望。In this paper,the thermal conductivity mechanism of filled epoxy resins was firstly introduced,and then the research status of the modified epoxy resins doped with different dimensional inorganic thermal conductive fillers was summarized mainly.On the basis of design idea for building the thermal conductive paths,the effect of different dimensions of filler size,distribution orientation,mixed filling,surface functionalization and other factors on improving the thermal conductivity of epoxy resin composites were described emphatically,and a comparative analysis was given.Finally,a brief outlook on the future development of the filled epoxy resin research field was put forward.

关 键 词：环氧树脂 填料维度 导热网络 热导率 

分 类 号：TM215[一般工业技术—材料科学与工程]