芯片封装用单组份高导热结构胶的研制及性能表征  

Preparation and Characterization of Single Component High Thermal Conductive Structural Adhesive for Chip Packaging

作　　者：李会录[1] 倪福容 王刚 夏婷 张攀 李颖[1] LI Huilu;NI Furong;WANG Gang;XIA Ting;ZHANG Pan;LI Ying(College of Materials Science and Engineering,Xi'an University of Science and Technology,Xi'an 710054,China)

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054

出　　处：《绝缘材料》2022年第3期38-44,共7页Insulating Materials

基　　金：国家自然科学基金资助项目(51903207、21204072);陕西省重点研发计划项目(2018GY-174、2018GY-115)。

摘　　要：本文以双酚A型环氧树脂为主体树脂、聚硫醇为固化剂,咪唑为促进剂制备了低黏度、中温快速固化的基础胶液,通过表干、凝胶化时间和差示扫描量热仪(DSC)测试,探讨了胶液的固化工艺;添加导热填料混合制备导热结构胶,通过对其粘接强度、热导率和黏度等性能测试,研究了填料粒径、形状和用量对性能的影响。结果表明:当基础胶液与不同粒径Al_(2)O_(3)质量之比即m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(2μm Al_(2)O_(3))=15∶7∶3、m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(5μm Al_(2)O_(3))=15∶7∶3、m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(10μm Al_(2)O_(3))=15∶8∶2时,导热结构胶可在90℃下、15 min内快速固化,其热导率分别为2.46、2.59、2.42 W/(m·K),粘接强度分别为5.92、6.46、6.49 MPa,黏度分别为63800、74100、87000 mPa·s,满足丝网印刷工艺和芯片封装散热材料的基本性能要求。A low viscosity,fast-curing single component thermally conductive structural adhesive base glue was prepared by using bisphenol A epoxy resin E124 as the main resin,polythiol as the curing agent,and imidazole as the accelerator,its curing process was discussed by surface drying time and gel time test and DSC test.A thermal conductive structural adhesive was prepared by adding thermal conductive fillers,and the particle size,shape and amount of fllers on the properties were studied.The results show that when the mass ratio of the base glue to two different sizes of alumina,which is m(base glue):m(40 pum Al_(2)O_(3)):m(2 um Al_(2)O_(3))=15:7:3,m(base glue):m(40μm Al_(2)O_(3)):m(5 pum Al_(2)O_(3))=15:7:3,m(base glue):m(40 um Al_(2)O_(3)):m(10 pum Al2O;)=15:8:2,the three high thermal conductive structural adhesives could cure at 90C in 15 min.Their thermal conductivity is 2.46,2.59,and 2.42 W/(m:K),adhesive strength is 5.92,6.46,and 6.49 MPa,viscosity is 63800,74100,and 87000 mPa's,respectively,which meets the basic performance requirements of screen printing process and chip package heat dissipation materials.

关 键 词：环氧树脂 聚硫醇固化剂 热导率 粘接强度 填料 

分 类 号：TM215.43[一般工业技术—材料科学与工程]