应力诱发界面扩散下夹杂演化的有限元模拟  

Finite Element Simulation of the Evolution Process of Inclusions due to Stress-induced Interface Diffusion

作　　者：井亚彬 黄佩珍[1] Yabin Jing;Peizhen Huang(State Key Laboratory of Mechanics and Control of Mechanical Structures,Nanjing University of Aeronautics and Astronautics Nanjing,210016)

机构地区：[1]南京航空航天大学机械结构力学及控制国家重点实验室,南京210016

出　　处：《固体力学学报》2022年第1期16-27,共12页Chinese Journal of Solid Mechanics

基　　金：江苏省自然科学基金项目(BK20141407);江苏高校优势学科建设工程项目资助。

摘　　要：应力作用下内连导线中的夹杂等缺陷会迁移和变形,从而影响电子器件的可靠性.论文基于应力诱发表面扩散机制下的弱解描述,推导了固-固界面在界面扩散机制下的有限单元控制方程,并数值分析了应力诱发界面扩散下金属内连导线中夹杂的形貌演化.研究结果表明:在拉压应力下,夹杂会发生分节或者圆形化;在双向等值拉应力下,夹杂存在着沿长轴生长和圆形化两种分叉趋势.并且存在着临界应力、临界形态比和临界线宽.形态比、应力越小或线宽、模量比越大,夹杂越易演化为圆形.Defects such as inclusions in interconnects will migrate or deform under stress, thus affecting the reliability of electronic devices. Based on the weak statement of stress-induced surface diffusion mechanism, the finite element governing equations of the solid-solid interface under the interface diffusion mechanism are derived, and the morphology evolution of inclusions in interconnects under the stress-induced interface diffusion mechanism is numerically analyzed. The results show that, the inclusion will be segmented or rounded under tensile and compressive stresses. Under the bidirectional equivalent tensile stress, there are two bifurcation trends of the inclusion: growing along the long axis or circularizing. And there exist the critical stress, the critical aspect ratio and the critical linewidth. The smaller is the aspect ratio or the stress, or the larger is the linewidth or the modulus ratio, the easier does the inclusion evolve into a circle. This study may be helpful in understanding the behaviors of the evolution of inclusions in interconnects and designing interconnects with high reliability.

关 键 词：夹杂演化 界面扩散 有限单元法 应力迁移 

分 类 号：O344.1[理学—固体力学] O241.82[理学—力学]