Mg_(2)Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints  

作　　者：Cao Huijun Li shiqin Zhang Yinggan Zhu Yichen Li Mingyu Zhang Zhihao 操慧珺;李世钦;张英干;朱轶辰;李明雨;张志昊(College of Materials,Xiamen University,Xiamen 361000,China;Shenzhen Research Institute,Xiamen University,Shenzhen 518055,China;School of Transportation Engineering,Xiamen City University,Xiamen 361005,China;Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China)

机构地区：[1]College of Materials,Xiamen University,Xiamen 361000,China [2]Shenzhen Research Institute,Xiamen University,Shenzhen 518055,China [3]School of Transportation Engineering,Xiamen City University,Xiamen 361005,China [4]Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China

出　　处：《China Welding》2022年第1期47-59,共13页中国焊接（英文版）

基　　金：supported by Science and Technology Planning Project of Shenzhen (Grant No. JCYJ201908 09161213154);Xiamen Youth Innovation Fund Project (Grant No. 3502Z20206026);Academy-level Project of Xiamen City University (Grant No.KYKJ2019-4)。

摘　　要：In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg_(2)Sn nanoparticles were the dominant reason of Sn whisker growth.The Mg_(2)Sn accumulation at the grain boundaries would pin the dislocation slip and affect the continuity of whisker growth,and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg_(2)Sn.This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.

关 键 词：Mg alloys ultrasonic wave solder joint Sn whisker microstructure growth mechanism 

分 类 号：O784[理学—晶体学]