兼具低频磁屏蔽效能的印制板组件热沉制备与测试  

Preparation and Test of Printed Circuit Board Assembly Heat Sink with Low Frequency Magnetic Shielding Effectiveness

作　　者：周旭 陈晨[2] 顾卫标 钱爱平[1] ZHOU Xu;CHEN Chen;GU Weibiao;QIAN Aiping(Xinglin College,Nantong University,Nantong 226019,Jiangsu,China;School of Computer Science,Xiamen University,Xiamen 361005,Fujian,China)

机构地区：[1]南通大学杏林学院,江苏南通226019 [2]厦门大学计算机学院,福建厦门361005

出　　处：《制冷技术》2021年第6期40-45,共6页Chinese Journal of Refrigeration Technology

摘　　要：某弹载电子设备中功率印制板组件同时需要散热与低频磁屏蔽,但缺乏质轻又有足够厚度的磁屏蔽材料来达到要求的屏蔽效能。本文对此现状进行散热与电磁兼容性协同设计,在石蜡中掺杂密度仅为0.22 g/cm^(3)的纳米Ni粉制备成质轻复合相变材料,并与铝合金6061制成的屏蔽体一起构成多功能热沉。实验结果表明:热沉的热容较大,潜热为240.8 kJ/kg;吸热较快,复合材料的导热系数达到0.77 W/(m·K);吸热效率较高,相变时间为160 s;器件壳温升到85℃的时间超过14 min;在0.01~30 MHz内的磁屏蔽效能大于30 dB。该热沉能够对弹上印制板组件起到散热与低频磁屏蔽的双重作用。In a missile borne electronic equipment, printed circuit board assembly needs heat dissipation and low frequency magnetic shielding at the same time, but there is a lack of light and thick magnetic shielding material to achieve the required shielding effectiveness. The co-design of heat dissipation and electromagnetic compatibility is carried out. Nano Ni powder with density of 0.22 g/cm^(3)was doped into paraffin to prepare light composite phase change material, and a multifunctional heat sink was formed with the shield made of aluminum alloy 6061. A series of test results show that the heat capacity of the heat sink is large, the latent heat is 240.8 kJ/kg;the heat absorption is fast, the thermal conductivity of the composite material reaches 0.77 W/(m·K);the heat absorption efficiency is high, the phase transition time is 160 s;the time of the device shell temperature rising to 85 ℃ is more than 14 min;and the magnetic shielding efficiency is more than 30 dB in 0.01-30 MHz. The heat sink can play a dual role of heat dissipation and low-frequency magnetic shielding for printed circuit board assembly in missile.

关 键 词：散热 热沉 相变材料 磁屏蔽 

分 类 号：TB611[一般工业技术—制冷工程] TQ051.5[化学工程]