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作 者:闫曦[1] 雷世文[1] 陶则超[1] 孔庆强[1] YAN Xi;LEI Shiwen;TAO Zechao;KONG Qingqiang(CAS Key Laboratory of Carbon Materials,Institute of Coal Chemistry,Chinese Academy of Sciences,Taiyuan 030001,China)
机构地区:[1]中国科学院炭材料重点实验室,中国科学院山西煤炭化学研究所,太原030001
出 处:《固体火箭技术》2022年第1期44-49,共6页Journal of Solid Rocket Technology
基 金:国家自然科学基金(21576277)。
摘 要:针对新型轻质高效和结构稳定的高性能隔热材料在航空航天领域的应用需求,以热塑性酚醛树脂为原料,引入氧化石墨烯(GO)进行改性,然后采用液相低压发泡/炭化工艺制备氧化石墨烯/酚醛树脂基泡沫炭(PCF)隔热材料。采用扫描电镜(SEM)、热分析仪、压汞仪和激光脉冲导热仪,对GO/PCF的结构及性能进行了测试与表征。结果表明:添加GO合理的质量含量是1.0%,添加量过大时,GO会团聚,影响泡沫炭的孔结构和微观结构,导致泡沫炭强度和体积密度下降,热导率上升;GO的适量引入可改善酚醛树脂的热稳定性,相对于未改性样品,1.0%GO/PCF的热解温度及热稳定性提高,残碳率提高5%;分散均匀的GO在酚醛树脂中形成三维多孔网状结构,具有良好的气流传热和辐射传热抑制效果;1.0%GO/PCF的体积密度为0.20 g/cm^(3),结构致密,热导率仅0.05 W/(m·K),具有优异的隔热性能。High-performance thermal insulation materials with lightweight and high efficiency and stable structure are essential in aerospace.Thermoplastic phenolic resin was modified by graphene oxide(GO)to prepare the phenolic resin-based carbon foam(PCF)insulation material,using the liquid-foaming process at a low pressure followed with carbonization.The microstructure and properties of the GO/PCF were characterized by scanning electron microscope(SEM),thermal analyzer,mercury porosimeter and laser flash diffusivity apparatus.The results show that the optimized mass content of GO is about 1.0%.Agglomeration will be induced by the excessive adding of GO,and then the pore structure and microstructure of the carbon foam are affected,leading to a decrease in strength and bulk density and an increase in thermal conductivity.The thermal stability of phenolic resin can be improved by the suitable introduction of GO.When GO content is 1.0%,the initial decomposition temperature and thermal stability of phenolic resin increases,while carbon yield is increased by 5%.A three-dimensional porous network structure can be obtained when GO is uniformly dispersed in phenolic resin,accompanying with a good suppression effects of air flow heat transfer and radiation heat transfer.The volume density and low thermal conductivity of PCF with 1.0%of GO are 0.20 g/cm^(3) and 0.05 W/(m·K),respectively,exhibiting an excellent candidate of thermal insulation material.
分 类 号:V258[一般工业技术—材料科学与工程]
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