金刚石表面镀W对金刚石/Cu复合材料热导率的影响  

Effect of W Plating Diamond on Thermal Conductivity of Diamond/Cu Composites

作　　者：孙龙 杨琳[1] 王亚丽[1] 李黎忱[1] SUN Long;YANG Lin;WANG Yali;LI Lishen(College of Materials Science and Engineering,Taiyuan University of Technology,Taiyuan 030024,China)

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《热加工工艺》2022年第4期59-63,共5页Hot Working Technology

基　　金：国家自然科学基金青年科学基金项目(51402206)。

摘　　要：采用物理气相沉积技术,在金刚石表面镀上W层,然后采用放电等离子体烧结(SPS)制备金刚石/Cu复合材料,研究了镀膜时间对复合材料的热导性能的影响。结果表明:随着镀膜时间的增加,金刚石表面W元素覆盖区域逐渐增多,复合材料致密度逐渐增大,热导率先增大后减小。当镀膜时间为30 min时,复合材料致密度达到91.3%,热导率达到最大值327 W/(m·K)。The W-coating was deposited on diamond surface by physical vapor deposition,then the diamond/Cu composites were prepared by spark plasma sintering(SPS).The effect of coating time on the thermal conductivity of the composites was studied.The results show that,with the increase of coating time,the area covered by W element on diamond surface increases gradually.Meanwhile,the density of composites increases gradually,and the thermal conductivity increases first and then decreases.When the coating time is 30 min,the density and thermal conductivity of the composite reach 91.3%and 327 W/(m·K),respectively.

关 键 词：热导率 金刚石/Cu复合材料 SPS 表面镀层 显微组织 

分 类 号：TB333.1[一般工业技术—材料科学与工程] TG174.44[金属学及工艺—金属表面处理]