二氧化硅表面化学镀银研究  

Study on silver plating on the surface of silicon dioxide

作　　者：陈勇 吴明阳 谭晓明 熊航行[1] 冯靖 朱琼 CHEN Yong;WU Ming-yang;TAN Xiao-ming;XIONG Hang-xing;FENG Jing;ZHU Qiong(College of Chemical Engineering and Pharmacy,Jingchu University of Technology,Jingmen 448000,Hubei,China;Jingmen Green Chemical Technology Research Institute,Jingmen 448000,Hubei,China;Hubei Benxin Environmental Protection Hi-tech Co.Ltd.,Wuhan 430074,China)

机构地区：[1]荆楚理工学院化工与药学院,湖北荆门448000 [2]荆门化工绿色技术研究院,湖北荆门448000 [3]湖北本心环保科技有限公司,武汉430074

出　　处：《贵金属》2021年第4期55-60,共6页Precious Metals

基　　金：湖北省教育厅科学研究项目(B2020198);荆楚理工学院科研项目(ZD202106);荆门市科技局项目(2018YFYB048);荆楚理工学院教育教学研究项目(JX2018-024);湖北省大学生创新创业训练项目(202011336022/202011336023);荆楚理工学院大学生创新创业训练项目(KC2021029)。

摘　　要：通过二氧化硅(SiO_(2))表面硅烷偶联剂改性,继续以聚甲基吡咯烷酮(PVP)为稳定剂,银氨溶液为银源,葡萄糖与甲醛为二元还原剂,对SiO_(2)表面化学镀银工艺进行了研究。最佳镀银工艺条件为:当AgNO_(3)/SiO_(2)质量比为1:1,葡萄糖浓度为0.1 g/mL,反应温度为30℃,反应溶液pH值为13.5,能够获得较高导电率的SiO_(2)镀银(SiO_(2)-Ag)复合粒子,最高导电率为2564 S/cm。使用红外光谱、X射线衍射、热重分析和偏光显微镜等表征产物的物化性能,结果表明:PVP参与化学镀银反应,使SiO_(2)-Ag的热失重变大。基于实验结果探讨了二氧化硅化学镀银的反应机理。Silicon dioxide(SiO_(2)) surface was modified by silane coupling agent,then the electroless silver plating process was studied with polymethylpyrrolidone(PVP)as stabilizer,silver ammonia solution as silver source,glucose and formaldehyde as binary reducing agent.The optimal silver plating process conditions were obtained as follows:the mass ratio of AgNO_(3)/SiO_(2) was 1:1,the concentration of glucose was 0.1 g/mL,the reaction temperature was 30℃and the pH value of the reaction solution was 13.5.The results showed that SiO_(2)-Ag composite particles can be obtained with the highest conductivity 2564 S/cm.The physicochemical properties of SiO_(2)-Ag were characterized by infrared spectrometer,X-ray diffractometer,thermogravimetry and polarizing microscope,and the results showed that PVP participated in the electroless silver plating reaction,which made the thermogravimetry of SiO_(2)-Ag increased.The mechanism of electroless silver plating on SiO_(2) was discussed based on the experimental results.

关 键 词：二氧化硅 硅烷偶联剂改性 化学镀银 导电性能 

分 类 号：TB383.1[一般工业技术—材料科学与工程] O614.122[理学—无机化学]