硬脆材料平面研抛的材料去除机理研究进展  

Research Progress of Material Removal Mechanism in Plane Lapping andPolishing of Hard-Brittle Materials

作　　者：刘宁 朱永伟 李学 吴鹏飞 LIU Ning;ZHU Yongwei;LI Xue;WU Pengfei(Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机电学院,江苏省精密与微细制造技术重点实验室,南京210016

出　　处：《材料导报》2022年第7期80-91,共12页Materials Reports

基　　金：国家自然科学基金联合基金(U20A20293)。

摘　　要：硬脆材料具有膨胀系数低、强度高以及化学性质稳定等优点,被广泛应用于航空航天、光学器件和集成电路等重要领域。但其因高硬度、低韧性,在加工过程中极易发生脆性断裂,影响加工效率和表面质量。因此,实现硬脆材料的高效去除以获得低损伤的加工表面是当前硬脆材料加工面临的主要难题。研磨抛光加工是实现硬脆材料表面平坦化的常用加工方式,可以在保证较高材料去除率的同时获得纳米级的表面粗糙度。研磨加工时,工件材料在磨粒的切削、耕犁、挤压及划擦作用下被去除,该方式作用下的材料去除率较高,但容易造成严重的亚表面损伤。因此在后续的抛光加工中,通常利用化学抛光液与工件材料之间的化学反应来进一步消除损伤,提升表面加工质量。然而,研磨抛光工艺的加工系统复杂,影响因素众多,为了合理地调控加工工艺参数,需要对材料去除机理进行深入的研究。目前硬脆材料研磨抛光加工的材料去除机理大体可分为机械作用和化学-机械协同作用两个方面。其中机械作用下的材料去除形式表现为塑性域去除和脆性去除,化学-机械协同作用下的化学反应类型又可分为由摩擦作用引起的固相化学反应以及由化学抛光液导致的化学成键与断裂。本文介绍了硬脆材料平面研抛的常用加工方法,从机械作用和化学-机械协同作用两个角度综述了硬脆材料平面研抛的材料去除机理,指出了现阶段研究中存在的问题并对未来的研究方向进行了展望。Hard-brittle materials have low expansion coefficient, high strength and stable chemical properties, which are widely used in aerospace, opti-cal devices, integrated circuits and other key industry fields. However, brittle fracture issue is easy to occur due to its high hardness and poor toughness, and it will severely affect processing efficiency and surface quality. Therefore, how to achieve the high material removal rate(MRR) and gain a low-damage machined surface is the main challenge for hard-brittle materials at present. Lapping and polishing are the common processing methods to realize the surface flattening of hard-brittle materials, which can obtain the good MRR and nano-scale surface roughness. The workpiece is removed by cutting, ploughing, squeezing and scratching of abrasives during the lapping process, and this removal form is efficient but will cause the serious subsurface damage. Thus, the chemical reaction between slurry and workpiece materials is usually utilized in polishing process to further eliminate the damage and improve the surface quality. Nevertheless, the machining systems of the lapping and polishing are complicated with many influencing factors. In order to regulate the processing parameters rationally, it is necessary to study the material removal mechanism deeply. Currently, the material removal mechanism of hard-brittle materials can be divided into two aspects, mechanical effect and chemical-mechanical synergistic operation. The mechanical effect can be classified as ductile removal and brittle removal, while the chemical-mechanical synergistic operation is manifested as solid-phase reactions and chemical bonding and fracture, which result from friction and slurry respectively. This paper introduces several processing technologies for hard-brittle materials in plane lapping and polishing, and reviews the material removal mechanism from the perspective of mechanical and chemical-mechanical synergy effect. Finally, we focus on the problems confronting in the current investigation a

关 键 词：硬脆材料 研磨 抛光 材料去除机理 

分 类 号：TG73[金属学及工艺—刀具与模具] TG74