低温固化工艺对环氧-氰酸酯树脂性能影响研究  

Study on the Effect of Low Temperature Curing Process on the Performance of Epoxy-Cyanate Resin

作　　者：王莹 朱金华[1] 刘晓辉[1] 张大勇[1] 荣立平 王刚[1] 赵颖[1] 李欣[1] 米长虹[1] WANG Ying;ZHU Jin-hua;LIU Xiao-hui;ZHANG Da-yong;RONG Li-ping;WANG Gang;ZHAO Ying;LI Xin;MI Chang-hong(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2022年第2期109-114,共6页Chemistry and Adhesion

基　　金：黑龙江省科学院杰青项目资助(编号:CXJQ2019SH02)。

摘　　要：主要研究了环氧-氰酸酯(EP-CE)树脂在三种低温固化工艺(80℃/96h.120℃/48h、100℃/12h+150℃/12h)条件下性能和结构的变化。结果表明:固化工艺对树脂固化度、玻璃化温度、高温剪切强度和介电损耗的影响比较明显。三种低温固化工艺树脂的固化度分别为78.74%.93.41%.96.38%,T_(g)分别为87.4℃,139.73℃.162.6℃;150℃剪切强度分别为15.65MPa、18.59MPa.20.49MPa;10GHz介电损耗分别为0.02235.0.02047.0.01979;固化工艺对室温剪切强度和TG性能影响较小。IR分析结果表明:在较低温度固化时,氰酸酯基团首先发生了三聚反应.同时伴随有异氰脲酸酯结构的生成。固化温度增加有利于树脂中环氧基团与异氰脲酸酯生成[口恶]唑烷酮的反应。The performance and structure of epoxy-cyanate ester(EP-CE)resin cured with three kinds of low temperature curing processes(80℃/96h,120℃/48h,100℃/12h+150℃/12h)are studied.The results show that the curing process has obvious ffets on the curing degree,T。high temperature shear strength and dielectric loss of resin.The curing degree of resins cured with three kinds of low-temperature curing processes respec-tively is 78.74%,93.41%and 96.38%;the T_(g),is 87.4℃,139.73℃ and 162.6℃ respectively;The 150℃ shear strength of resins is 15.65MPa,18.59MPa and 20.49MPa respectively;And the dielectric loss of the cured product at 10GHz is 0.02235,0.02047,0.01979 respeetively.The curing process has lttle efeet on the room temperature shear strength and TG performance of resin.The IR analysis show that the cyanale group undergoes the trimeriza-tion firstly and is accompanied by the formation of isocyanurale structure when cures at a lower temperalure.The epoxy groups in the resin are more likely to react with isocyanurate to form oxazolidinone when the curing temperature increases.

关 键 词：氰酸酯 环氧树脂 低温固化 胶粘剂 

分 类 号：TQ320.2[化学工程—合成树脂塑料工业]