一种晶闸管硅堆压装机构设计  

Design of a Press Mounting Mechanism for Thyristor Stack

作　　者：李钊 宋戈 陈赤汉 杨懿功 张子敬[2] 张翔[2] 方太勋[2] LI Zhao;SONG Ge;CHEN Chihan;YANG Yigong;ZHANG Zijing;ZHANG Xiang;FANG Taixun(NR Electric Power Electronics Co.,Ltd.,Changzhou 213025,China;NR Electric Co.,Ltd.,Nanjing 211102,China)

机构地区：[1]常州博瑞电力自动化设备有限公司,江苏常州213025 [2]南京南瑞继保电气有限公司,江苏南京211102

出　　处：《电工技术》2022年第4期134-136,139,共4页Electric Engineering

摘　　要：为解决6英寸晶闸管压接面压力分布均匀性问题,针对6英寸晶闸管硅堆的压装机构进行了研究,设计了一种采用球面定位的球头式压装机构,并仿真校核了球头式压装机构的机械强度。开展了6英寸晶闸管硅堆压接力压力均匀性试验,试验结果表明,在正常和模拟工况下,球头式压装机构能明显改善晶闸管压接面压力分布均匀性。In order to solve the problem of pressure distribution uniformity of 6-inch thyristor crimping surface,the press mounting mechanism of 6-inch thyristor silicon stack is studied.A ball-end press-fitting mechanism with spherical positioning is designed,and the mechanical strength is simulated and checked.The pressure uniformity test of 6-inch thyristor silicon stack pressure relay is carried out.The test results show that,under normal and simulated working conditions,the ball-head press-fit mechanism can significantly improve the uniformity of pressure distribution on the thyristor press-contact surface.

关 键 词：特高压换流阀 晶闸管 压装机构 压力均匀性 

分 类 号：TN05[电子电信—物理电子学]