基于ANSYS的高速背板互联结构静载荷仿真分析  

Static Load Simulation Analysis of High-speed Backplane Inter- Connection Structure Based on ANSYS

作　　者：赵鲁燕 李鹏[1] 农红密[1] Zhao Luyan;Li Peng;Nong Hongmi(Ocean Engineering College,GuiLin University of Electronic Technology,Guangxi Beihai 536000,China)

机构地区：[1]桂林电子科技大学海洋工程学院,广西北海536000

出　　处：《科技通报》2022年第1期45-48,共4页Bulletin of Science and Technology

基　　金：国家自然科学基金项目(61474032)。

摘　　要：通信整机内高速背板互联结构承担着信号传输的关键作用,应用ANSYS软件建立了高速背板互联结构有限元模型,针对3种不同互联结构进行了静载荷作用下的仿真分析,探讨了静载荷作用下的背板应力应变分布规律。研究结果表明,3种背板互联结构在重力惯性载荷条件下应力均处于较低水平,结构应力最大值发生在铜合金焊针上且远小于材料静载荷强度极限。整体背板结构应力最大值出现在铜合金焊针与焊点连接处,且应力最大值远小于背板强度极限,静载荷作用条件下高速背板互联结构是可靠的。基于分析结果可后续对互联结构及传输载体接口结构部分进行强度分析,有利于背板结构改进和结构参数优化。The high-speed backplane interconnection structure in the communication machine is responsible for the key role of signal transmission. The finite element model of the high-speed backplane interconnection structure is established using ANSYS software, and the simulation analysis under static load is carried out for three different interconnection structures. The stress and strain distribution law of the back plate under load. The research results show that the stress of the three backplane interconnection structures is at a relatively low level under the conditions of gravitational inertia load, and the maximum structural stress occurs on the copper alloy solder pins and is much smaller than the material static load strength limit. The maximum stress of the overall backplane structure appears at the junction of the copper alloy solder pins and the solder joints, and the maximum stress is much smaller than the strength limit of the backplane. The high-speed backplane interconnection structure is reliable under static load conditions. Based on the analysis results, the strength analysis of the interconnection structure and the interface structure of the transmission carrier can be carried out, which is conducive to the improvement of the backplane structure and the optimization of the assembly plan.

关 键 词：高速背板 互联结构 静载荷 有限元分析 

分 类 号：TN60[电子电信—电路与系统]