微米铜银复合结构与纳米银混合连接材料制备与高频感应快速烧结方法研究  

Fabrication of Micron-Cu@Ag and Nano-Ag Particle Connection Material and Study of High Frequency Induction Rapid Sintering Method

作　　者：吴卓寰 刘威[1] 温志成 王一平 田艳红[1] 王春青[1] WU Zhuohuan;LIU Wei;WEN Zhicheng;WANG Yiping;TIAN Yanhong;WANG Chunqing(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,尔滨150001

出　　处：《机械工程学报》2022年第2期26-33,共8页Journal of Mechanical Engineering

基　　金：国家自然科学基金资助项目(51375003)。

摘　　要：利用置换反应实现了微米铜银复合结构颗粒的制备,在试验中改变反应温度、反应物比例及反应时间从而确定了制备微米铜银复合结构颗粒的最优反应参数。合成了粒径大小均匀,分散性良好的纳米银颗粒,平均粒径为14.33 nm左右。通过计算设计了两种颗粒的混合比例,按照该比例制备了微米铜银复合结构与纳米银混合焊膏并制备成三明治结构用于高频感应加热烧结,成功实现了微米铜银复合结构与纳米银混合焊膏对铜-铜基板的连接,并研究了在高频感应加热条件下,功率大小对微观连接界面的影响。试验结果表明,加热功率的增加会使界面的孔隙等缺陷减少,致密性显著提高。加热功率26 kW下,烧结时间15 s时,剪切强度可达48 MPa。Cu@Ag micron particles were synthesized by replacement reaction,and the most excellent parameters of reaction process were determined via altering temperature,proportion and time during the reaction.Nano-scale Ag particles with uniform size and good dispersibility were synthesized,the average diameter was about 14.33 nm.The mixed proportion of these two kinds of particles was obtained by calculation,which was used for the preparation of mixed solder paste.The sandwich structure was sintered by high frequency induction heating,and direct Cu bonding was realized successfully.Moreover,the influence of electromagnetic power on the micro-interface has been discussed.As the result,increasing electromagnetic power can reduce defects such as pores at the interface,the densification can be improved significantly.The shear strength of bare Cu joint structure was achieved about 48 MPa when bonded at 26 kW for 15 s.

关 键 词：微米铜银复合结构颗粒 纳米银 高频感应加热 快速连接 

分 类 号：TG407[金属学及工艺—焊接]