SiP器件组装焊点形态预测及其随机振动可靠性仿真研究  

Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction

作　　者：撒子成 王尚[1] 冯佳运 马竟轩 张宁[2] 于广良[2] 梁洁玫[2] 田艳红[1] SA Zicheng;WANG Shang;FENG Jiayun;MA Jingxuan;ZHANG Ning;YU Guangliang;LIANG Jiemei;TIAN Yanhong(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001;Development Center of On-Board Computer and Electronics,Beijing Institute of Control Engineering,Beijing 100089)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]北京控制工程研究所星载计算机及电子产品研制中心,北京100089

出　　处：《机械工程学报》2022年第2期276-283,共8页Journal of Mechanical Engineering

基　　金：黑龙江省“头雁”团队经费资助项目。

摘　　要：针对振动条件下系统级封装(System in Package,SiP)器件的振动可靠性问题,利用ANSYS软件进行随机振动仿真,并对模型进行参数校正从而获得器件的随机振动疲劳寿命。首先,采用Surface Evolver软件对鸥翼形引脚焊点形态进行预测,并将模型数据导入ANSYS中完成模型建立;进行不同载荷量级的正弦振动试验,对SiP器件模型进行材料参数校正,并对校正后模型进行振动仿真,获得危险点应力数据,结合试验所得的疲劳寿命数据拟合得到材料的S-N曲线;最后,通过随机振动仿真分析确定器件危险薄弱点,通过S-N曲线和Dirlik寿命预测模型,得到SiP器件的随机振动可靠性寿命。本文介绍了针对SiP器件的随机振动可靠性试验及模拟结果,提出了针对器件寿命的评价通用方法,为器件在整机应用条件下的寿命评价提供理论依据。On the issue of the reliability of System in Package(SiP)devices under vibration,ANSYS is used to simulate the process of random vibration.The material parameters of the model are corrected to obtain the random vibration fatigue life of the device.Firstly,the solder joint geometry of the gull wing lead is simulated by Surface Evolver,and the calculation result is imported into ANSYS.Sinusoidal vibration experiments are carried out under different load levels to correct material parameter.The stress at dangerous points is calculated by vibration simulation.The S-N curve is obtained by fitting the sinusoidal vibration experimental data and the simulation data.Finally,the weak points of the device are obtained through random vibration simulation.The S-N curve obtained above is utilized in the random vibration fatigue life prediction model to get the fatigue life of the SiP device.The random vibration reliability experiment and simulation results for SiP devices are introduced.A general method for fatigue life prediction is established,which provides reference for the whole machine fatigue life prediction.

关 键 词：焊点形态预测 随机振动 可靠性 有限元分析 

分 类 号：TG156[金属学及工艺—热处理]