冷却方式对SAC305无铅焊料合金组织性能的影响  

Influence of Cooling Method on Microstructure Properties and Fracture Mode of SAC305 Solder

作　　者：梁东成 陈东东[1,2] 张欣 秦俊虎 卢红波 解秋莉 易健宏 严继康[1,3] LIANG Dongcheng;CHEN Dongdong;ZHANG Xin;QIN Junhu;LU Hongbo;XIE Qiuli;YI Jianhong;YAN Jikang(Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming 650501,China;School of Engineering,Southwest Petroleum University,Nanchong 637001,Sichuan,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业锡材有限公司,云南昆明650501 [3]西南石油大学工程学院,四川南充637001

出　　处：《昆明理工大学学报（自然科学版）》2022年第1期16-21,共6页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：云南省电子贴装用锡焊料系列产品开发项目(2018ZE004);云南锡业锡材有限公司汽车电子用高可靠焊料合金开发及应用研究省创新团队项目(202105AE160028)。

摘　　要：研究了不同冷却方式(水冷、油冷、空冷、炉冷)对SAC305(Sn-Ag3.0-Cu0.5)焊料的金相组织、润湿性能、熔化热性能和力学性能的影响.按照一定质量配比的SnAg3和SnCu10融化混合,通过改变不同冷却凝固速率制备SAC305焊料合金,利用光学显微镜、可焊性测试仪、差式扫描热分析仪和万能力学拉伸仪测定焊料合金组织性能,并使用JSM-7800F场发射扫描电镜对断口进行形貌分析以判定断裂模式.研究结果表明:水冷处理的焊料合金组织细化最明显,冷却速率越大,钎料抗拉强度越高,断裂模式逐渐从纯塑性断裂过渡至混合断裂,润湿性能随着冷却速率的增大而下降,炉冷处理的钎料润湿时间最短,且最大润湿力为0.869 mN;热分析方面,经过水冷处理的钎料,熔化特性最佳,熔程为4.717℃,具有较好的流动性.经过综合评价,通过水冷工艺处理的焊料合金性能最佳.The effects of different cooling methods(water cooling, oil cooling, air cooling and furnace cooling)on the microstructure, wettability, melting thermal properties and mechanical properties of SAC305(Sn-Ag3.0-Cu0.5)solder were studied.According to the melting mixture of SnAg3 and SnCu10 with a certain mass ratio, the SAC305 solder alloy was prepared by changing the cooling and solidification rates. The microstructure and properties of the solder alloy were measured by optical microscope, weldability tester, differential scanning thermal analyzer and universal mechanical tensile tester. The fracture morphology was analyzed by JSM-7800 F field emission scanning electron microscope to determine the fracture mode. The results show that the microstructure refinement of solder alloy after water cooling treatment is the most obvious. The higher the cooling rate is, the higher the tensile strength is. The fracture mode gradually changes from pure plastic fracture to mixed fracture. The wettability decreases with the increase of cooling rate. The wetting time of the solder is the shortest and the maximum wetting force is 0.869 mN. In terms of thermal analysis, the solder treated by water cooling has the best melting characteristic, the melting range is 4.717 ℃, and it has good fluidity. After comprehensive evaluation, the solder alloy treated by water cooling process has the best properties.

关 键 词：冷却方式 锡银铜焊料 组织性能 断裂模式 

分 类 号：TG425[金属学及工艺—焊接]