聚酰亚胺薄膜材料的热膨胀行为研究进展  

Research progress in thermal expansion behavior of polyimide films

作　　者：王畅鸥 翟磊[1] 高梦岩 贾妍 莫松[1] 何民辉[1] 范琳[1,2] Chang-Ou Wang;Lei Zhai;Meng-Yan Gao;Yan Jia;Song Mo;Min-Hui He;Lin Fan(Key Laboratory of Science and Technology on High-tech Polymer Materials,Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190,China;School of Chemical Sciences,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]极端环境高分子材料重点实验室,中国科学院化学研究所,北京100190 [2]中国科学院大学化学科学学院,北京100084

出　　处：《中国科学：化学》2022年第3期437-451,共15页SCIENTIA SINICA Chimica

基　　金：国家自然科学基金(编号:51803221)资助项目。

摘　　要：由于聚酰亚胺薄膜较高的热膨胀系数会对器件的性能和可靠性产生重要影响,新一代高性能低膨胀聚酰亚胺薄膜材料的热膨胀行为引起了人们的极大关注.目前针对聚酰亚胺薄膜所开展的热膨胀研究主要集中于面内热膨胀,而面外及体积热膨胀行为、热膨胀各向异性的研究则较少,缺乏对薄膜热膨胀行为机理的系统性深入认识.本文系统总结了国内外在聚酰亚胺薄膜面内、面外及体积热膨胀方面取得的研究成果,详细介绍了薄膜面内与面外的热膨胀评价表征方法,重点阐述了聚酰亚胺的分子主链结构、局部分子运动、化学交联结构、薄膜聚集态结构及制备工艺等对热膨胀行为的影响机制,并对下一步面临的挑战与研究方向进行了展望.As one of the most important flexible substrates and interlayer dielectric materials, the thermal expansion performance of polyimide films has always attracted great interest. Especially with the development of advanced electronic and microelectronic devices, the linear and volumetric thermal expansion of polyimide films are facing more and more stringent requirements. In order to explore new generation polyimide films with low thermal expansion, it is necessary to clarify the thermal expansion behaviors and influence mechanism. For polymer films, the thermal expansion actually includes in-plane and out-of-plane linear as well as volumetric thermal expansion. Most researches on thermal expansion of polyimide films are focused on the in-plane thermal expansion, but there are few studies on the out-of-plane and volume thermal expansion of films. There is no systematic understanding of the mechanism of thermal expansion behavior. The research on linear and volume thermal expansion behavior of polyimide films were firstly summarized in this article. The testing methods were introduced in detail, including thermomechanical analysis(TMA),variable temperature wide-angle X-ray diffraction(VT-WAXD), capacitance technique, optical interferometry, etc. The influencing factors of thermal expansion behavior of polyimide films were discussed, such as molecular backbone structures, local molecular motions, chemical crosslinking, aggregation structures and film preparation process. The relationship between structures and processes on in-plane, out-of-plane linear and volumetric thermal expansion behavior of polyimide films was clarified. The problems and challenges in the future research on thermal expansion were prospected. This review can provide a necessary guidance for the development of high-performance polyimide films with low thermal expansion in the wide temperature range.

关 键 词：聚酰亚胺 薄膜 热膨胀行为 表征方法 影响因素 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] TB383.2[一般工业技术—材料科学与工程]