贴片式电阻器滚镀工艺影响因素分析及改进  

Analysis on factors affecting the barrel plating of chip fixed resistor and process improvement

作　　者：孙杰 孙学亮 崔浩冉 杨博 SUN Jie;SUN Xueliang;CUI Haoran;YANG Bo(Beijing 718 Yousheng Electronics Co.,Ltd.,Beijing 101200,China)

机构地区：[1]北京七一八友晟电子有限公司,北京101200

出　　处：《电镀与涂饰》2022年第5期360-363,共4页Electroplating & Finishing

摘　　要：贴片式电阻器尺寸小,在滚镀时往往存在镀层分布不均匀和电流效率低的问题。分析了影响贴片式电阻器滚镀的因素(包括滚筒阴极导电结构、陪镀物种类和比例),对各因素进行了优化,最终令镀层分布均匀性与电流效率都得以提高。Some problems such as nonuniform distribution of coating and low current efficiency often appear in barrel plating of chip fixed resistor due to its small size.The factors affecting the coating uniformity i.e.electric conduction system of cathode in barrel and type and dosage of dummy balls were analyzed.Both the coating uniformity and current efficiency were improved by making some modifications to the said factors.

关 键 词：贴片式电阻器 滚镀 镀层均匀性 电流效率 阴极导电结构 陪镀物 

分 类 号：TQ153.1[化学工程—电化学工业]