红外焦平面探测器芯片应力降低方法研究  

Research on Stress Reduction Method of Infrared Focal Plane Detector Chip

作　　者：张洪瑀 刘森[1] ZHANG Hong-yu;LIU Sen(North China Research Institute of Electro-Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《红外》2022年第3期16-21,共6页Infrared

摘　　要：以1280×1024红外焦平面探测器为例,利用三维可视化实体模拟软件建立了包含冷指部件、陶瓷框架、探测器芯片的三维模型,并利用ANSYS仿真软件对模型(仅球形冷台结构与常规冷台不同,其余零件均相同)进行了仿真对比。研究结果表明,球形冷台结构通过增加冷台与制冷机接触面的面积可以实现更低的芯片热应力以及更小的芯片热变形,进而提高探测器芯片的可靠性。The 1280×1024 infrared focal plane detector is taken as an example,and 3D visualization entity simulation software is used to establish a 3D model including cold finger parts,ceramic frame and detector chip in this paper.The simulation comparison is conducted by using ANSYS simulation software(only the spherical cold platform structure is different from the conventional cold platform,and other parts are the same).The results show that the spherical cold platform can achieve lower thermal stress and smaller thermal deformation of the chip by increasing the area of the contact surface between the cold platform and the refrigerator.And the reliability of the detector chip can be improved by this way.

关 键 词：红外探测器 有限元仿真 可靠性 

分 类 号：TN20[电子电信—物理电子学]