PCB板高温高湿偏置试验后的失效分析  

Failure Analysis of PCB after High Temperature and High Humidity Bias Test

作　　者：张浩敏 李鹏 沈旭刚 陈铁柱 ZHANG Haomin;LI Peng;SHEN Xugang;CHEN Tiezhu(CEPREI,Guangzhou 511370,China;Ningbo CEPREI IT Research Institute Co.,Ltd.,Ningbo 315040,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]宁波赛宝信息产业技术研究院有限公司,浙江宁波315040

出　　处：《电子产品可靠性与环境试验》2022年第1期16-22,共7页Electronic Product Reliability and Environmental Testing

摘　　要：针对PCB板在高温高湿偏置试验后的失效问题进行了分析。详细地介绍了分析的过程和手段,包括形貌观察、电参数测试、声学扫描检测、扫描电镜、能谱分析和离子色谱分析等分析手段,获得了导致PCB板漏电失效的原因是由于Cl^(-)的电化学腐蚀和电化学迁移,内部芯片存在分层现象,使得水汽进入芯片内部,发生爆米花效应,内键合线拉脱,芯片电连接不良而失效。The failure of PCB after high temperature and high humidity bias test is analyzed.The analysis process and methods are introduced in detail,including morphological observation,electrical parameter testing,acoustic scanning detection,scanning electron microscopy and energy spectrum analysis and ion chromatography analysis.It is found that the reason for the leakage failure of PCB board is due to the electrochemical corrosion and migration of Cl ions,and the stratification phenomenon exits in the inner chip,which causes water vapor to enter the chip,and the popcorn effect occurs,and the internal bond line pulls out,which leads to the failure of the chip due to poor electrical connection.

关 键 词：高温高湿偏置试验 电化学腐蚀 爆米花效应 失效分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]