填料含量及环氧基/酚羟基物质的量比对MUF模塑料翘曲性能的影响  

Effect of Filler Content and Epoxy Group/Phenolic Hydroxyl Group Mole Ratio on the Warpage Performance of MUF Epoxy Molding Compound

作　　者：曹二平 任荣 蔡晓东 牟海燕 CAO Erping;REN Rong;CAI Xiaodong;MOU Haiyan(Hysol Huawei Electronics Co.,Ltd.,Lianyungang 222000,China;Hysol Huawei Electronics Co.,Ltd.,Shanghai Hengsuo Electronics Branch,Shanghai 200120,China)

机构地区：[1]衡所华威电子有限公司,江苏连云港222000 [2]衡所华威电子有限公司上海衡锁电子分公司,上海200120

出　　处：《塑料工业》2022年第3期106-109,共4页China Plastics Industry

摘　　要：以开发低翘曲的模塑底部填充(MUF)模塑料为目的,研究了不同填料含量及环氧基/酚羟基物质的量比对模塑料翘曲性能的影响。结果表明,随着填料含量增加,环氧模塑料的热膨胀系数CTE_(1)、CTE_(2)和螺旋流动长度(SF)降低,当填料质量分数为90%时,其CTE_(1)和CTE_(2)分别为8.3×10^(-6)℃^(-1)和28×10^(-6)℃^(-1);随着环氧基/酚羟基物质的量比降低,模塑料的玻璃化转变温度(T_(g))先升高后降低,CTE_(1)不变,CTE_(2)先降低后升高,当环氧基/酚羟基物质的量比为0.9时,模塑料的T_(g)为139℃,CTE_(1)为9.8×10^(-6)℃^(-1),CTE_(2)为31×10^(-6)℃^(-1)。在低CTE_(1)、CTE_(2)的情况下,模塑料的翘曲性能最好。In order to develop low warping molded underfill(MUF)epoxy molding compound,the effects of different filler contents and epoxy group/phenolic hydroxyl group mole ratio on warpage performance of epoxy molding compound were studied.The results show that the coefficient of thermal expansion(CTE_(1),CTE_(2))and spiral flow(SF)of epoxy molding compound decrease with the filler content increasing.When the filler content is 90%,the CTE_(1) and CTE_(2) are 8.3×10^(-6)℃^(-1) and 28×10^(-6)℃^(-1),respectively.With the epoxy group/phenolic hydroxyl group mole ratio decreasing,the glass transition temperature(T_(g))of the epoxy molding compound increases first and then decreases,while CTE_(1) remains unchanged and CTE_(2) decreases first and then increases.When the epoxy group/phenolic hydroxyl group mole ratio is 0.9,the T_(g) of the epoxy molding compound is 139℃,CTE_(1) is 9.8×10^(-6)℃^(-1) and CTE_(2) is 31×10^(-6)℃^(-1).At low CTE_(1) and CTE_(2),the warp performance of the epoxy molding compound is the best.

关 键 词：低热膨胀系数 低翘曲 底部填充模塑料 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]