Pr对Sn58Bi钎料微观组织和性能的影响  

Effect of Pr on microstructure and properties of Sn58Bi solder

作　　者：姜艳[1] 何云龙 李楠[1] 罗庭碧[1] 杨东 Jiang Yan;He Yunlong;Li Nan;Luo Tingbi;Yang Dong(Honghe University,Mengzi 661199,Yunnan,China)

机构地区：[1]红河学院,云南蒙自661199

出　　处：《焊接》2022年第2期56-59,共4页Welding & Joining

基　　金：云南省应用基础研究项目(2013FZ123)。

摘　　要：通过在Sn58Bi合金钎料中添加Pr制备了新型无铅钎料,用该钎料进行焊接后,测定了Pr添加量对焊后钎料的晶格变化、润湿性和钎焊接头抗拉强度的影响。XRD衍射结果表明,Pr的添加能够导致钎料晶格畸变。SEM结果表明,微量Pr的添加可以抑制Bi相长大粗化,细化钎料晶粒。润湿性能研究表明,随着Pr量的增加,Sn58Bi钎料的润湿性有所改善,当添加质量分数为1.5%的Pr时,钎料的铺展率由81.97%扩大到88.41%,增加了7.86%;钎料力学性能显示,未添加Pr时钎焊接头抗拉强度为7.6318 MPa,而随着Pr的加入,其抗拉强度增加,当添加质量分数为1.5%的Pr,钎焊接头抗拉强度最大为11.1263 MPa,提高了45.79%。综合表明,适量Pr的添加可以有效改善Sn58Bi钎料的组织结构、润湿性和抗拉强度。A novel type of lead-free solder was prepared by adding Pr to Sn58Bi alloy solder.The influence of Pr dosage on the lattice change,tensile strength and wettability of the solder were studied after the solder was welded.XRD results indicated that the addition of Pr could cause lattice distortion of the solder.SEM analysis showed that a micro amount addition of Pr could inhibit the growth and coarsening of Bi phase and refine the grain size of the solder.The wettability test results showed that the wettability of Sn58Bi solder could be improved with the increase of Pr addition.When the mass fraction of Pr was 1.5%,the spreading rate of solder increased from 81.97%to 88.41%,being improved by7.86%.The solder mechanical properties results showed that the tensile strength of the soldered joint was 7.6318 MPa without Pr addition,while the tensile strength increased with the addition of Pr.When the mass fraction of Pr was 1.5%,the maximum the tensile strength of the soldered joint of 11.1263 MPa could be obtained,which increased by 45.79%.To sum up,it could be concluded that proper Pr addition could improve the microstructure,tensile strength and wettability of Sn58Bi solder effectively.

关 键 词：SN-BI PR 微观组织 润湿性 

分 类 号：TG425[金属学及工艺—焊接]