IGBT铜焊盘化学镀Ni-Fe-P的制备及耐蚀性研究  

Preparation and Corrosion Resistance of Electroless Ni-Fe-P Coating on IGBT Copper Pads

作　　者：彭娟 杜学铭[1] 刘生发[1] 刘俐 PENG Juan;DU Xuemin;LIU Shengfa;LIU Li(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China;State Key Laboratory of Materials Processing and Die&Mould Technology,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]武汉理工大学材料学院,湖北武汉430070 [2]华中科技大学材料成形与模具技术国家重点实验室,湖北武汉430074

出　　处：《电镀与精饰》2022年第4期11-15,共5页Plating & Finishing

基　　金：湖北省自然科学基金(2018CFB212);华中科技大学材料成形与模具技术国家重点实验室开放资金(P2018-018)。

摘　　要：针对IGBT模块中铜焊盘的腐蚀问题,采用化学镀方法在铜基板表面制备了Ni-Fe-P镀层。设计正交试验研究了镀液温度、pH、Fe^(2+)/Ni^(2+)摩尔比对镀层成分的影响,并通过电化学腐蚀实验分析镀层的耐腐蚀性能。结果表明,对于镀层中的Fe、P含量,影响因素的主次顺序均为:pH值、温度、Fe^(2+)/Ni^(2+)摩尔比。不同成分的Ni-Fe-P镀层均能有效地保护铜基板不被腐蚀,且镀层中Fe含量越高,镀层的耐腐蚀性能越好。Aiming at the corrosion problem of the copper pads in the IGBT module,Ni-Fe-P coating was prepared on copper substrates by electroless plating. The influences of bath temperature,pH,and Fe^(2+)/Ni^(2+)molar ratio on the composition of the coating were studied by orthogonal experiments,and the corrosion resistance of the coating was analyzed through electrochemical corrosion experiments. The results showed that the sequence of influencing factors for the content of Fe and P in the coating was pH value,plating temperature and Fe^(2+)/Ni^(2+)molar ratio. The Ni-Fe-P coatings of different compositions could effectively protect the copper substrate from corrosion,and the coatings showed better corrosion resistance with the Fe content increasing.

关 键 词：化学镀 Ni-Fe-P镀层 正交试验 耐腐蚀性能 工艺参数优化 

分 类 号：TQ174.4[化学工程—陶瓷工业]