基于响应面法的电源组件散热结构优化设计  

Heat Dissipation Structure Optimization Design of Power Supply Module Based on Response Surface Method

作　　者：王多笑[1] 罗浩[1] 梁清清 WANG Duoxiao;LUO Hao;LIANG Qingqing(The 43rd Research Institute of CETC,Hefei 230088,China;School of Mathematics,Hefei University of Technology,Hefei 230009,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088 [2]合肥工业大学数学学院,安徽合肥230009

出　　处：《电子机械工程》2022年第2期42-45,55,共5页Electro-Mechanical Engineering

摘　　要：文中以某型电源组件为对象,在外部散热和外形尺寸一定的条件下,利用有限元分析技术,进行了组件外壳的结构参数和散热能力之间关系的分析。以降低元器件温度为目标,同时兼顾组件重量,基于响应面方法对结构参数进行了优化,指导了组件外壳的结构设计,提高了组件的整体可靠性,也为同类产品的优化设计提供了参考。In this paper, the relationship between the structure parameters and the heat dissipation ability of the shell of a certain power supply module with fixed external heat dissipation and fixed overall dimensions is analyzed based on the finite element analysis technique. Aiming at reducing the component temperature while considering the weight increase, the structure parameters are optimized using response surface method.The result of the optimization guides the structure design of the module, improves its overall reliability. The optimization process in this paper can also be used as a reference for the optimization design of other similar products.

关 键 词：电源组件 优化设计 热分析 响应面方法 

分 类 号：TN603[电子电信—电路与系统]